The miniaturization of electronics devices into the nanometer scale is indispensable for next-generation semi-conductor technology. However, the determination of interconnect structures of carbon nanotubes (CNTs) is difficult to do experimentally in nanosoldering process and the investigation of dynamic evolution between CNTs is still lacking during nanoscale soldering. So, the nanoscale soldering of positioned single-walled carbon nanotubes with "T-", "Y-" and "X-" junction is proposed and demonstrated with molecular dynamics simulation. As the simulation results, when the number of the deposited nanoparticles is small, the nanoscale soldering processes of "T-" and "Y-" junction are accomplished through the silver nanoparticles melting and bunching up in a larger droplet due to its higher surface energy. With the increase of simulation time, the splitting phenomenon of nano-droplet exists in the interconnection configuration. However, when the number of the deposited nanoparticles is large, the nano-mound can completely wrap the crossed X-junction without splitting phenomenon. Furthermore, the dominant mechanism of the interesting phenomenon is also analyzed. (C) 2013 Elsevier B. V. All rights reserved.