3-(3,4-dichloro phenyl)-1,1-dimethylurea이 Epoxy/Dicyandiamide계의 경화에 미치는 영향

김형순; 김완영; 김영자

Journal of the Korean Industrial and Engineering Chemistry, Vol.7, No.5, 963-969, October, 1996

Export Citation

3-(3,4-dichloro phenyl)-1,1-dimethylurea이 Epoxy/Dicyandiamide계의 경화에 미치는 영향

The Effects of 3-(3,4-dichloro phenyl)-1,1-dimethylurea on the Cure of Epoxy/Dicyandiamide System

김형순, 김완영, 김영자

초록

에폭시 수지를 접착제의 base resin으로 이용하기 위해 DGEBA/dicy계의 경화특성을 조사하였다. dicy는 상온에서 저장안정성이 우수하여 일액형 접착제의 경화제로서 유용하다. 그러나 고온에서 경화시 열분해될 우려가 있으므로 경화온도를 낮추기 위해 diuron을 경화촉진제로 사용하였다. Epoxy/dicy계에서 dicy의 사용량이 증가함에 따라 경화반응열이 증가하였으며, 경화 후 수지의 유리전이온도(T_g)도 증가하는 것으로 관찰되었다. Diuron을 경화촉진제로 사용함으로써 약 40℃정도 낮은 온도에서 경화반응이 진행되었으며, 수지의 유리전이온도는 감소되었다. 경화반응의 속도론적 고찰은 Kamal이 제안한 자촉매반응의 모델식으로 해석하였으며, diuron의 경화촉진 효과를 확인할 수 있었다.

Cure characteristics of DGEBA(diglycidyl ether of bisphenol A)/dicy(dicyandiamide) system containing diuron(3-(3,4-dichloro phenyl) -1,1-dimethylurea) as an accelerator was investigated. The system has shelf life of six months because dirty is insoluble In liquid/solid resins at room temperature. It is generally known that dicy is an adequate curing agent for one component adhesive due to its highly latent property. With increasing the amount of added dicy, reaction heat of DGEBA/dicy system increased and degree of conversion was not varied. For DGEBA/dicy/diuron system, cure temperature decreased about 40℃ and cure reaction became fast by the addition of diuron which activates dicy. T_g of the mixed resin decreased with the amount of accelerator. which was interpreated with molecular structure forming loose chain. Cure kinetics of DGEBA/dicy and DGEBA/dicy/diuron system were explained using Kamal's autocatalytic reaction model. The effect of acceleration was confirmed with that reaction model.

[References]

Schmidt RG, Bell JP, Advanced in Polymer Science, 75, 33, Springer-Verlag, Berlin (1986)
May CA, "Epoxy Resins-Chemistry and Technology," 2nd ed., Chap. 2, Marcel Dekker Inc., New York (1988)
Ozawa T, J. Thermal Anal., 2, 301 (1970)
Kissinger HE, J. Res. Nat. Bur. Stds., 57, 217 (1956)
Fava RA, Polymer, 9, 137 (1968)
Shim JS, Lee W, Jang J, Polym. J., 23(7), 911 (1991)
Gonzalez-Romero VM, Casillas N, 1119, ANTEC'87
Elder JP, J. Thermal Anal., 30, 657 (1985)
Kamal MR, Sourour S, Polym. Eng. Sci., 13, 59 (1973)
Mijovic J, Kim J, Slaby J, J. Appl. Polym. Sci., 29, 1449 (1984)
Horie K, Hiura H, Sawada M, Mita I, Kambe H, J. Polym. Sci. A: Polym. Chem., 8, 1357 (1970)
Ryan ME, Dutta A, Polymer, 20, 203 (1979)
Prime RB, Polym. Eng. Sci., 13, 365 (1973)

[Referenced By]

[1] Schmidt RG, Bell JP, Advanced in Polymer Science, 75, 33, Springer-Verlag, Berlin (1986)

[2] May CA, "Epoxy Resins-Chemistry and Technology," 2nd ed., Chap. 2, Marcel Dekker Inc., New York (1988)

[3] Ozawa T, J. Thermal Anal., 2, 301 (1970)

[4] Kissinger HE, J. Res. Nat. Bur. Stds., 57, 217 (1956)

[5] Fava RA, Polymer, 9, 137 (1968)

[6] Shim JS, Lee W, Jang J, Polym. J., 23(7), 911 (1991)

[7] Gonzalez-Romero VM, Casillas N, 1119, ANTEC'87

[8] Elder JP, J. Thermal Anal., 30, 657 (1985)

[9] Kamal MR, Sourour S, Polym. Eng. Sci., 13, 59 (1973)

[10] Mijovic J, Kim J, Slaby J, J. Appl. Polym. Sci., 29, 1449 (1984)

[11] Horie K, Hiura H, Sawada M, Mita I, Kambe H, J. Polym. Sci. A: Polym. Chem., 8, 1357 (1970)

[12] Ryan ME, Dutta A, Polymer, 20, 203 (1979)

[13] Prime RB, Polym. Eng. Sci., 13, 365 (1973)