Al or B layers of a few hundreds of nm in thickness deposited on BaSi2 epitaxial films on Si(1 1 1) substrates were annealed at different temperatures, and the diffusion coefficients of Al and B were evaluated using secondary ion mass spectrometry with O2+. We also investigated the effect of post annealing (850 degrees C, 10 min) of BaSi2 films on the diffusion coefficients. It was found that both the lattice diffusion and the grain boundary diffusion were decreased by the post-annealing. The plan-view transmission electron microscopy images revealed that the grain size was increased from approximately 0.2 to 0.6 mu m by the annealing, and the X-ray diffraction intensities also increased. The activation energies of lattice and grain boundary diffusions in the post-annealed BaSi2 are 0.63 eV and 0.58 eV for Al, and 4.6 eV and 4.4 eV for B, respectively. (c) 2013 Elsevier B.V. All rights reserved.