We have investigated the formation of ruthenium Schottky contacts on both n- and p-type 6H-SiC wafers. it is found that Ru forms good quality rectifying contacts, with barrier heights of 0.67 eV and 1.06 eV for n-type and p-type SiC, respectively and ideality factors in the range 1.4 - 1.6. Annealing experiments indicated that the Ru Schottky contacts remained stable up to 450 degreesC, above which a general deterioration in the quality of the contacts (as indicated by an increase in the measured idealities as well as an increase in the reverse bias leakage currents) was observed. It is also shown that the Ru Schottky contact to p-type SiC provides an excellent means through which to introduce hydrogen into the SiC using a hydrogen plasma.