Microtexture of 0.18mum, 0.25mum, 0.70mum, and 2mum widths Cu damascene line is measured by EBSD technique. The image drift could be reduced by the shortening of measurement time, and could be completely removed by selected area mapping technique. Using carbon and gold dual layer coating method, image drift and pattern indexing fraction is improved but the EBSD pattern quality is decreased. By increasing the accelerating voltage from 15kV to 20kV, pattern quality loss could be compensated without resolution loss. Strong {111} texture is obtained in 0.18 and 0.25mum line, and weak {111} texture is observed in 2mum line. And every line was observed to have more than 60% CSL boundaries.