A comparative study was made of texture evolution following uni-axial compression of Oxygen Free Electronic (OFE) copper with a strong <111> + <100> fiber texture at low and high strain rates. Accelerated texture evolution with a higher work hardening rate are observed at low strains under high strain rate deformation. However, under both strain rate conditions the texture components become random at a logarithmic strain of 0.35. A previous study identified this level of strain as generating an equiaxed grain structure in the material, prior to the development of a compressed grained structure.