Changes in the orientation distribution during dynamic recrystallization are investigated by texture measurements and EBSP analyses. Uniaxial compression tests are conducted in vacuum on polycrystalline pure nickel in the temperatures and strain rates ranging from 873K to 1573K and 1.0x10(-4s-1) to 1.0x10(-2)s(-1), respectively. It is found that weak texture develops under the deformations at lower temperature and higher strain rate conditions, namely the conditions where the Zener-Hollomon parameter Z is high (hereafter called as high Z conditions), while almost no texture is observed at higher temperature and lower strain rate conditions (hereafter called as low Z conditions). The behavior of texture formation at low Z conditions is different from the dynamic recrystallization of intermetallic compound TiAl investigated before. EBSP measurements show that new grains having random orientations are formed in the regions close to grain boundaries at high Z conditions. It is suggested that the serration of grain boundaries plays an important role to produce the area having random orientations in the neighborhood of grain boundaries. The orientations of these grains change towards the stable orientation for uniaxial compression, resulting in the formation of weak texture. At the deformation in low Z conditions new grains are formed by the migration of the existing grain boundaries. It is found that many twins are formed during the migration. At the deformation under the lowest Z condition, almost half of the high angle grain boundaries are twin boundaries. It is concluded that the texture formation in dynamic recrystallization is dominated by the local deformation affected by the shape change of grain boundary and twin formation during the migration of existing grain boundaries.