The evolutions of surface morphologies in sputtered and electroplated Copper films during annealing were investigated. After annealing at 435degreesC, in the electroplated Copper films grooves along the grain boundaries were observed, while in the sputtered films voids were observed at the triple junctions and along the grain boundaries. The textures and grain boundary characteristics of two films were analyzed. The densities of low energy boundaries were analyzed to explain the difference of the surface morphologies.