Grain refinement of metallic materials may be achieved by imposing severe plastic deformation through procedure such as Equal Channel Angular Extrusion (ECAE). In this work, the development of the fine microstructure in copper after 1, 4 and 8 passes was studied. Samples were obtained by rotating billets through 90 degrees between each extrusion path (route Bc). Transmission Electron Microscopy has been employed to measure crystallographic orientations and to draw the corresponding color maps. The thermal stability of the ultrafined grained copper manufactured by the ECAE process was examined by imposing static annealing treatment at 200degreesC. At this temperature, recrystallization is observed, but the recrystallized grain size remains small (23 mum) even after long annealing times.