Texture, microstructure and stresses were investigated in 0.18 mum damascene Cu interconnect lines. Additionally, for purpose of comparison, the same parameters were investigated in 0.25 mum, 2 mum damascene Cu lines and Cu blanket film. Measurements were done using x-ray diffraction (XRD) and orientation imaging microscopy (OIM). Both macro and microtexture were characterized by computing the orientation distribution functions (ODFs) and inverse pole figures. Microstructure was characterized by computing - unique grain color maps, mean grain size and coincident site lattice (CSL) boundary distribution. Stresses were measured by XRD using sin(2)psi method.