Interfacial defects existing near the SiO(2)/SiC interface are an important issue for fabrication of high performance SiC devices. We investigate a thermally grown SiO(2)/SiC layer of 4H-SiC MOS structure by positron annihilation spectroscopy. The Doppler broadening of annihilation quanta was measured as a function of the incident positron energy and the gate bias. Applying a negative gate bias, significant increases in S-parameters were observed. This indicates the migration of implanted positrons towards the SiO(2)/SiC interface and annihilation at interfacial defects. Ultraviolet (UV) ray irradiation was used to extract the influence of the positron trapping to the interfacial states. S-parameters in the interface region were reduced by UV irradiation. This shows that positron trapping probability decreased because the charge state of interfacial defects changed to positive. From the recovery of S-parameters after 24 hours, the interfacial states discharge slowly and exist in large quantities, because the changes of S-parameter by the UV irradiation are larger than changes induced by bias change.