Nowadays alumina ceramic substrates are widely used for high precision applications in electronic devices, such as hybrid integrated circuits (HIC). Usually, the alumina ceramic substrates are shaped through tape casting method and sintered in continuous slab kilns. The sintering aids used to enhance densification during sintering give rise to the formation of an alumino-silicate liquid phase, which is of crucial importance in pressureless and low-temperature sintering ( < 1600degreesC) of alumina ceramics. The preferential migration of liquid phase to the surface of alumina substrates under the capillary action and its transformation into glassy phase during cooling affects the subsequent processing steps of HIC. A smoothening effect on surface with its enrichment in glassy phase is accompanied by a decrease of the surface toughness. On the other hand, the accumulated glassy phase onto the surface has a great effect on laser cutting. The high temperatures developed during laser cutting turn the superficial glassy phase into liquid again, while rapid solidification will occur after removing laser beam. The fast cooling of the liquid phase causes formation of extensive network of cracks on the surface of alumina substrate. Apparently, the presence of such faults degrades mechanical strength and thermal shock resistance of alumina substrates. Meanwhile, the recast layers and spatter deposits at the periphery of the hole has been observed.