The mechanical behavior of nano grain-sized pure copper produced by various SPD (severe plastic deformation) processes such as ECAP (equal channel angular pressing) and ARB (accumulated roll bonding) was investigated in relation to the microstructural evolution. These processes promoted the formation of equiaxed nanoscale grains in pure copper. The present observation suggested that the tensile behavior of the specimens prepared by the current SPD processes was influenced by several mechanisms involving strain hardening and dynamic recovery. The heat flow was measured by using a DSC (differential scanning calorimeter) to elucidate the relationship between the dislocation density and the tensile behavior in the specimens.