The polymerizability and film properties of a variety of mellophanic dianhydride (MLPDA)-based polyimides (PIs) were systematically investigated for applications related to novel high-temperature adhesive materials. The MLPDA-based PIs showed T(g)'s comparable to or lower than those of the corresponding pyromellitic dianhydride (PMDA)-based PIs. Some of the MLPDA-based PI systems simultaneously achieved high Tg's at approximately 300 degrees C, excellent film toughness (an elongation at break. epsilon(b) = 60-160%), high adhesion strengths with a copper foil (even at a relatively low processing temperature of 350 degrees C), relatively low water absorption, good thermo-oxidative stability, and excellent solution-processability. (C) 2010 Elsevier Ltd. All rights reserved.