The curing kinetics of an extrinsic toughened epoxy (mixture of diglycidyl ether of bisphenol-A and 1,4-butanediol epoxy resin, DGEBA/DGEBD) and an intrinsic toughened epoxy (ethoxylated bisphenol-A epoxy resin with two oxyethylene units, DGEBAEO-2) using hexahydrophthalic anhydride (HHPA) as curing agent and tris-(dimethylaminomethyl) phenol (DMP-30) as accelerator were comparatively studied by non-isothermal DSC with a model-fitting Malek approach and a model-free advanced isoconversional method of Vyazovkin. The dynamic mechanical properties and thermal stabilities of the cured materials were investigated by DMTA and TGA, respectively. The results showed that Sestak-Berggren model can generally simulate well the reaction rates of these two systems. The activation energy of DGEBA/DGEBD/HHPA/DMP-30 at high fractional conversion changed much higher than that of DGEBAEO-2/HHPA/DMP-30, indicating the increased steric hindrance mainly affected the reaction kinetic scheme of DGEBA/DGEBD/HHPA/DMP-30. The T-g and storage moduli of cured DGEBAEO-2/HHPA/DMP-30 were lower than those of cured DGEBA/DGEBD/HHPA/DMP-30 according to DMTA while TGA showed that the thermal stabilities of these two cured systems were similar. (C) 2012 Elsevier B.V. All rights reserved.