Thin Solid Films, Vol.556, 87-98, 2014
Strain-free, single-phase metastable Ti0.38Al0.62N alloys with high hardness: metal-ion energy vs. momentum effects during film growth by hybrid high-power pulsed/dc magnetron cosputtering
A hybrid deposition process consisting of reactive high-power pulsed and dc magnetron cosputtering (HIPIMS and DCMS) from Ti and Al targets is used to grow Ti1-xAlxN alloys, with x similar to 0.6, on Si(001) at 500 degrees C. Two series of films are deposited in which the energy and momentum of metal ions incident at the growing film are individually varied. In both sets of experiments, a negative bias V-s ranging from 20 to 280 V is applied to the substrate in synchronous, as determined by in-situ mass spectrometry, with the metal-ion-rich part of the HIPIMS pulse. Ion momentum is varied by switching the HIPIMS and dc power supplies to change the mass m and average charge of the primary metal ion. Al-HIPIMS/Ti-DCMS layers grown under Al+ (m(Al) = 26.98 amu) bombardment with 20 <= V-s <= 160 V are single-phase NaCl-structure alloys, while films deposited with V-s > 160 V are two-phase, cubic plus wurtzite. The corresponding critical average metal-ion momentum transfer per deposited atom for phase separation is < p(d)*> >= 135 [eV-amu](1/2). In distinct contrast, layers deposited in the Ti-HIPIMS/Al-DCMS configuration with Ti+/Ti2+ (m(Ti) = 47.88 amu) ion irradiation are two-phase even with the lowest bias, V-s = 20 V, for which < p(d)*> > 135 [eV-amu](1/2). Precipitation of wurtzite-structure AlN is primarily determined by the average metal-ion momentum transfer to the growing film, rather than by the deposited metal-ion energy. Ti-HIPIMS/Al-DCMS layers grown with V-s= 20 V are two-phase with compressive stress sigma= -2 GPa which increases to -6.2 GPa at V-s= 120 V; hardness H values range from 17.5 to 27 GPa and are directly correlated with sigma. However, for Al-HIPIMS/Ti-DCMS, the relatively low mass and single charge of the Al+ ion permits tuning properties of metastable cubic Ti0.38Al0.62 N by adjusting V-s to vary, for example, the hardness from 12 to 31 GPa while maintaining sigma similar to 0. (C) 2014 Elsevier B.V. All rights reserved.
Keywords:High power impulse magnetron sputtering;High-power pulsed magnetron sputtering;Titanium aluminium nitride;Ionized physical vapor deposition;Magnetron sputtering