Macromolecular Research, Vol.22, No.9, 983-989, September, 2014
Enhanced thermal and mechanical properties of polyimide/graphene composites
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Polyimide (PI)/graphene sheets (GSs) composites were prepared by solution blending. The incorporation of GSs into PI increased the thermal conductivity, thermal stability and mechanical properties of PI. The thermal conductivity of PI/GSs composites was significantly improved compared with that of neat PI from 0.254 to 1.002 W/mK; this can be attributed to the homogeneous dispersion of graphene and the formation of heat conduction pathway. Furthermore, the Young modulus of PI/GSs was raised up to 4.04 GPa, approximately two-fold enhancement in comparison with that of neat PI. In addition, the incorportation of GSs in PI indicated excellent optical transparency at the lowest weight fractions of GSs and modified wettability of PI films.
- Kim GY, Choi MC, Lee D, Ha CS, Macromol. Mater. Eng., 297, 303 (2012)
- Lee J, Choi MC, Park SS, Ha CS, Macromol. Res., 19(6), 599 (2011)
- Luong ND, Hippi U, Korhonen JT, Soininen AJ, Ruokolainen J, Johansson LS, Nam JD, Sinh LH, Seppala J, Polymer, 52(23), 5237 (2011)
- Wang JY, Yang SY, Huang YL, Tien HW, Chin WK, Ma CCM, J. Mater. Chem., 21, 13569 (2011)
- Li TL, Hsu SLC, J. Phys. Chem. B, 114, 6835 (2010)
- Naganuma T, Kakisawa H, Dericioglu AF, Kagawa Y, Nippon Seramikkusu Kyokai Gakujutsu Ronbunshi, 114, 713 (2006)
- Kume S, Yamada I, Watari K, Harada I, Mitsuishi K, J. Am. Ceramic Soc., 92, 153 (2009)
- Tanimoto M, Yamagata T, Miyata K, Ando S, ACS Appl. Mater. Interfaces, 10, 4374 (2013)
- Kim BS, Bae SH, Park YH, Kim JH, Macromol. Res., 15(4), 357 (2007)
- Tseng I, Chang JC, Huang SL, Tsai MH, Polym. Int., 62, 827 (2012)
- Kim SC, Lee HI, Jeong HM, Kim BK, Kim JH, Shin CM, Macromol. Res., 18(11), 1125 (2010)
- Lee C, Wei X, Kysar JW, Hone J, Science, 321, 385 (2008)
- Novoselov KS, Geim AK, Morozov SV, Jiang D, Zhang Y, Dubonos SV, Grigorieva IV, Firsov AA, Science, 306, 666 (2004)
- Yoonessi M, Scheiman DA, Dittler M, Peck JA, Ilavsky J, Gaier JR, Meador MA, Polymer, 54, 2784 (2013)
- Yoonessi M, Shi Y, Scheiman DA, Lebron-Colon M, Tigelaar DM, Weiss RA, Meador MA, ACS Nano, 6, 7644 (2012)
- Balandin AA, Ghosh S, Bao W, Calizo I, Teweldebrhan D, Miao F, Lau CN, Nano Lett., 8, 902 (2008)
- Teng CC, Ma CCM, Lu CH, Yang SY, Lee SH, Hsiao MC, Yen MY, Chiou KC, Lee TM, Carbon, 49, 5107 (2011)
- Fang M, Wang K, Lu H, Yang Y, Nutt S, J. Mater. Chem., 19, 7098 (2009)
- Fu SY, Feng XQ, Lauke B, Mai YW, Compos. Part B: Eng., 39, 933 (2008)
- Yu J, Huang X, Wu C, Jiang P, IEEE Trans. Dielectr. Electr. Insul., 18, 478 (2011)
- Wu XL, Liu P, Macromol. Res., 18(10), 1008 (2010)
- Ramakrishnan S, Dhakshnamoorthy M, Jelmy EJ, Vasanthakumari R, Kothurkar NK, RSC Advances, 4, 9743 (2009)
- Wang YY, Ni ZH, Yu T, Shen ZX, Wang HM, Wu YH, Chen W, Shen Wee AT, J. Phys. Chem. C, 112, 10637 (2008)
- Park OK, Hwang JY, Goh M, Lee JH, Ku BC, You NH, Macromolecules, 46(9), 3505 (2013)
- Li XA, Wang B, Liu Z, Mater. Rev., 1, 15 (2012)
- Ferrari AC, Meyer JC, Scardaci V, Casiraghi C, Lazzeri M, Mauri F, Piscanec S, Jiang D, Novoselov KS, Roth S, others, Phys. Rev. Lett., 97, 187401 (2006)
- Hu Y, Shen J, Li N, Ma H, Shi M, Yan B, Huang W, Wang W, Ye M, Compos. Sci. Technol., 70, 2176 (2010)
- Im H, Kim J, J. Mater. Sci., 47(16), 6025 (2012)
- Hill RF, Supancic PH, J. Am. Ceram. Soc., 85(4), 851 (2002)
- Ishida H, Rimdusit S, Thermochim. Acta, 320(1-2), 177 (1998)
- Shen XJ, Pei XQ, Fu SY, Friedrich K, Polymer, 5, 1242 (2012)
- Zhang LB, Wang JQ, Wang HG, Xu Y, Wang ZF, Li ZP, Mi YJ, Yang SR, Compos. Part A: Appl. Sci. Manuf., 43, 1537 (2012)
- Hamciuc C, Hamciuc E, Okrasa L, Macromol. Res., 19(3), 250 (2011)
- Ha HW, Choudhury A, Kamal T, Kim DH, Park SY, ACS Appl. Mater. Interfaces, 4, 4623 (2012)
- Huang T, Xin Y, Li T, Nutt S, Su C, Chen H, Liu P, Lai Z, ACS Appl. Mater. Interfaces, 11, 4891 (2013)
- Bagri A, Grantab R, Medhekar NV, Shenoy VB, J. Phys. Chem. C, 114, 12053 (2010)