플립칩 본딩용 접착제 특성에 미치는 촉매제의 영향

민경은; 이준식; 유세훈; 김목순; 김준기; Kyung-Eun Min; Jun-Sik Lee; Sehoon Yoo; Mok-Soon Kim; Jun Ki Kim

Korean Journal of Materials Research, Vol.20, No.12, 681-690, December, 2010

DOI10.3740/MRSK.2010.20.12.681 Export Citation

플립칩 본딩용 접착제 특성에 미치는 촉매제의 영향

Effects of Catalysts on the Adhesive Properties for Flip Chip Bonding

민경은^{1, 2}, 이준식¹, 유세훈¹, 김목순³, 김준기^{1, †}

¹한국생산기술연구원 용접접합기술센터/마이크로조이닝센터
²인하대학교 금속공학과
³인하대학교 마이크로조이닝센터

Kyung-Eun Min^{1, 2}, Jun-Sik Lee¹, Sehoon Yoo¹, Mok-Soon Kim², and Jun Ki Kim^{1, †}

¹Advanced Welding & Joining Technology Center, KITECH, Incheon, Korea
²School of Materials Science & Engineering, Inha University, Incheon, Korea

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The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

Keywords:flip chip bonding;epoxy adhesive;imidazole catalyst;curing behavior

[References]

Teh LK, Anto E, Wong CC, Mhaisalkar SG, Wong EH, Teo PS, Chen Z, Thin Solid Films, 462-463, 446 (2004)
Ho PS, Wang G, Ding M, Zhao JH, Dai X, Microelectron. Reliab., 44, 719 (2004)
Lu D, Wong CP, Materials for Advanced Packaging, p.719, Springer, USA (2008). (2008)
Petrie E, Epoxy Adhesive Formulations, p.85-109, McGRAW-HILL, USA (2005). (2005)
Yim MJ, Paik KW, Int. J. Adhesion. Adhesive., 26, 304 (2006)
Ham YR, Lee DH, Kim SH, Shin YJ, Yang M, Shin JS, J. Ind. Eng. Chem., 16(5), 728 (2010)
Sun G, Sun HG, Liu Y, Zhao BY, Zhu N, Hu K, Polymer, 48(1), 330 (2007)
Tamulevich TW, Moore VE, The Significance of Glass Transition Temperature on Epoxy Resins for Fiber Optic Applications, p.2-3, Epoxy Technology, Inc., USA. (1980)
Rieger J, Polymer Test., 20, 199 (2001)

[Referenced By]

[1] Teh LK, Anto E, Wong CC, Mhaisalkar SG, Wong EH, Teo PS, Chen Z, Thin Solid Films, 462-463, 446 (2004)

[2] Ho PS, Wang G, Ding M, Zhao JH, Dai X, Microelectron. Reliab., 44, 719 (2004)

[3] Lu D, Wong CP, Materials for Advanced Packaging, p.719, Springer, USA (2008). (2008)

[4] Petrie E, Epoxy Adhesive Formulations, p.85-109, McGRAW-HILL, USA (2005). (2005)

[5] Yim MJ, Paik KW, Int. J. Adhesion. Adhesive., 26, 304 (2006)

[6] Ham YR, Lee DH, Kim SH, Shin YJ, Yang M, Shin JS, J. Ind. Eng. Chem., 16(5), 728 (2010)

[7] Sun G, Sun HG, Liu Y, Zhao BY, Zhu N, Hu K, Polymer, 48(1), 330 (2007)

[8] Tamulevich TW, Moore VE, The Significance of Glass Transition Temperature on Epoxy Resins for Fiber Optic Applications, p.2-3, Epoxy Technology, Inc., USA. (1980)

[9] Rieger J, Polymer Test., 20, 199 (2001)