LTCC 보호층 형성에 따른 박막 전극패턴에 관한 연구

김용석; 유원희; 장병규; 박정환; 유제광; 오용수; Yong-Suk Kim; Won-Hee Yoo; Byeung-Gyu Chang; Jung-Hwan Park; Je-Gwang Yoo; Yong-Soo Oh

Korean Journal of Materials Research, Vol.19, No.7, 349-355, July, 2009

DOI10.3740/MRSK.2009.19.7.349 Export Citation

LTCC 보호층 형성에 따른 박막 전극패턴에 관한 연구

Effect of Protective layer on LTCC Substrate for Thin Metal Film Patterns

김용석^†, 유원희, 장병규, 박정환¹, 유제광¹, 오용수

삼성전기 eMD 센터
¹ACI Lab

Yong-Suk Kim^†, Won-Hee Yoo, Byeung-Gyu Chang, Jung-Hwan Park¹, Je-Gwang Yoo¹, and Yong-Soo Oh

Electro Material & Device Center, Korea
¹Advanced Circuit Interconnection Lab Samsung Electro-Mechanics Co., LTD., Suwon, 443-743, Korea

E-mail:

Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as TiO2 and SiO2. These electric signal patterns’ morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.

Keywords:LTCC;protective layer;thin metal film patterns;electro plating;etching

[References]

Rabe T, Schiller WA, J. Appl. Ceram. Technol., 2(5), 374 (2005)
Fang Y, Lanagan MT, Agrawal DK, Yang GY, Randall CA, Shrout TR, Henderson A, Randall M, Tajuddin A, J. Electroceramics, 15, 13 (2005)
Bellosi A, Monteverde F, Sciti D, Int. J. Appl. Ceram. Technol., 3(1), 32 (2006)
Cheng J, Agrawal D, Zhang Y, Roy R, J. Electroceramics, 9, 67 (2002)
Hagymasi M, Roosen A, Karmazin R, Dernovsek O, Haas W, J. Europ. Ceram. Soc., 25, 2061 (2005)
Cynthia S, Cisneros M, Sens. Actuators A., 138, 63 (2007)
Polzer E, Zero-Shrinking Sintering Process, p. 7-10, Mcgraw-Hill, USA (2007). (2007)
Tarn W, CRC handbook of metal etchants, p. 1258, CRCPress, UK (1990). (1990)
Kang NK, Multilayer interconnection nano materials and high integration process technology, p. 23~29, Ceramics, Seoul (2007). (2007)
Russak ML, Creter J, J. Electrochem. Soc., 131, 556 (1984)
Missel LI, Glang R, Handbook of thin film technology, p. 150~152, Mcgraw-Hill, USA (1970). (1970)
Jobin M, Taborelli M, Descouts P, J. Appl. Phys., 77, 5149 (1995)
Alemany LJ, Pardo E, Blasco JM, Mater. Charact., 44, 271 (2000)
Ban S, Iwaya Y, Kono H, Sato H, Dent. Mater., 12, 1115 (2006)
Gwathmey AT, Electrochem. Soc. Meet., WDC, 12 (1957). (1957)
Holloway K, Sinclair R, J. Appl. Phys., 61, 1359 (1987)

[1] Rabe T, Schiller WA, J. Appl. Ceram. Technol., 2(5), 374 (2005)

[2] Fang Y, Lanagan MT, Agrawal DK, Yang GY, Randall CA, Shrout TR, Henderson A, Randall M, Tajuddin A, J. Electroceramics, 15, 13 (2005)

[3] Bellosi A, Monteverde F, Sciti D, Int. J. Appl. Ceram. Technol., 3(1), 32 (2006)

[4] Cheng J, Agrawal D, Zhang Y, Roy R, J. Electroceramics, 9, 67 (2002)

[5] Hagymasi M, Roosen A, Karmazin R, Dernovsek O, Haas W, J. Europ. Ceram. Soc., 25, 2061 (2005)

[6] Cynthia S, Cisneros M, Sens. Actuators A., 138, 63 (2007)

[7] Polzer E, Zero-Shrinking Sintering Process, p. 7-10, Mcgraw-Hill, USA (2007). (2007)

[8] Tarn W, CRC handbook of metal etchants, p. 1258, CRCPress, UK (1990). (1990)

[9] Kang NK, Multilayer interconnection nano materials and high integration process technology, p. 23~29, Ceramics, Seoul (2007). (2007)

[10] Russak ML, Creter J, J. Electrochem. Soc., 131, 556 (1984)

[11] Missel LI, Glang R, Handbook of thin film technology, p. 150~152, Mcgraw-Hill, USA (1970). (1970)

[12] Jobin M, Taborelli M, Descouts P, J. Appl. Phys., 77, 5149 (1995)

[13] Alemany LJ, Pardo E, Blasco JM, Mater. Charact., 44, 271 (2000)

[14] Ban S, Iwaya Y, Kono H, Sato H, Dent. Mater., 12, 1115 (2006)

[15] Gwathmey AT, Electrochem. Soc. Meet., WDC, 12 (1957). (1957)

[16] Holloway K, Sinclair R, J. Appl. Phys., 61, 1359 (1987)