Pulse-reverse도금을 이용한 다층 PCB 빌드업 기판용 범프 생성특성

서민혜; 공만식; 홍현선; 선지완; 공기오; 강계명; Min Hye Seo; Man Sik Kong; Hyun Seon Hong; Jee-Wan Sun; Ki-Oh Kong; Kae Myung Kang

Korean Journal of Materials Research, Vol.19, No.3, 151-155, March, 2009

DOI10.3740/MRSK.2009.19.3.151 Export Citation

Pulse-reverse도금을 이용한 다층 PCB 빌드업 기판용 범프 생성특성

Characteristics of Plated Bump on Multi-layer Build up PCB by Pulse-reverse Electroplating

서민혜, 공만식, 홍현선^†, 선지완¹, 공기오¹, 강계명 ²

고등기술연구원
¹(주)호진플라텍
²서울산업대

Min Hye Seo, Man Sik Kong, Hyun Seon Hong^†, Jee-Wan Sun¹, Ki-Oh Kong¹, and Kae Myung Kang²

Plant Engineering Center, Institute for Advanced Engineering, Yongin, 449-863, Korea
¹Research and Development Team, Hojinplatech, Ansan, 425-100, Korea
²Department of Materials Engineering, Seoul National University of Technology, Seoul, 139-743, Korea

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Micro-scale copper bumps for build-up PCB were electroplated using a pulse-reverse method. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance. The electroplated micro-bumps were characterized using various analytical tools, including an optical microscope, a scanning electron microscope and an atomic force microscope. Surface analysis results showed that the electroplating uniformity was viable in a current density range of 1.4-3.0 A/dm2 at a pulse-reverse ratio of 1. To investigate the brightener concentration on the electroplating properties, the current density value was fixed at 3.0 A/dm2 as a dense microstructure was achieved at this current density. The brightener concentration was varied from 0.05 to 0.3 ml/L to study the effect of the concentration. The optimum concentration for micro-bump electroplating was found to be 0.05 ml/L based on the examination of the electroplating properties of the bump shape, roughness and grain size.

Keywords:build-up PCB;pulse-reverse plating;copper electroplating;current density;brightener

[References]

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[Referenced By]

[Related Articles]

[1] Tsukada Y, J. Jpn. Inst. Electron. Pack., 11(5), 306 (1996)

[2] Schattka D, Winkels S, Schultze JW, Metalloberflache, 51, 823 (1997)

[3] Winkler J, Jr. US patent 1,951,893 (1934). (1934)

[4] Perger G, Robinsom PM, Met. Finish, 77 (1979)

[5] Landolt D, Marlot A, Surf. Coat. Technol., 8, 169 (2003)

[6] Amdi A, Acid copper plating of prined circuits, p. 38, Product Finishing, OHIO, USA (1981). (1981)

[7] Seo MH, Hong HS, Jung WS, Korean J. Mater. Res., 18(3), 117 (2008)

[8] Puippe JC, Leaman F, Theory and Practice of Pulse Plating, p. 43, Amer. Electro Platers Soc., Orlando Florida, USA, (1986). (1986)

[9] Schlesinger M, Paunovic M, Modern Electroplating, 4th ed., p. 15, Schlesinger M, Paunovic M, John Wiley & Sons, New York, USA, (2000). (2000)

[10] enkatesan S, Gelatos AV, Misra V, Tech. Dig. Int. Conf. Electron Devices Meeting(IEEE, Piscattaway, 1997) p.769. (1997)

[11] Kelly JJ, West AC, J. Electrochem. Soc., 145 (1998)