화학공학소재연구정보센터
Korean Journal of Materials Research, Vol.18, No.7, 373-378, July, 2008
전자빔증발법에 의한 Ba(Ti,Sn)O3막의 제조 및 특성
Synthesis and Properties of Ba(Ti,Sn)O3 Films by E-Beam Evaporation
E-mail:
Ba(Ti,Sn)O3 thin films, for use as dielectrics for MLCCs, were grown from Sn doped BaTiO3 sources by e-beam evaporation. The crystalline phase, microstructure, dielectric and electrical properties of films were investigated as a function of the (Ti+Sn)/Ba ratio. When BaTiO3 sources doped with 20~50 mol% of Sn were evaporated, BaSnO3films were grown due to the higher vapor pressure of Ba and Sn than of Ti. However, it was possible to grow the Ba(Ti,Sn)O3 thin films with ≤15 mol% of Sn by co-evaporation of BTS and Ti metal sources. The (Ti+Sn)/Ba and Sn/Ti ratio affected the microstructure and surface roughness of films and the dielectric constant increased with increasing Sn content. The dielectric constant and dissipation factor of Ba(Ti,Sn)O3 thin films with ≤15 mol% of Sn showed the range of 120 to 160 and 2.5~5.5% at 1 KHz, respectively. The leakage current density of films was order of the 10.9~10.8 A/cm2 at 300 KV/cm. The research results showed that it was feasible to grow the Ba(Ti,Sn)O3 thin films as dielectrics for MLCCs by an e-beam evaporation technique.
  1. Kishi H, Mizuno Y, Chazono H, Jpn. J. Appl. Phys., 42(1), 1 (2003)
  2. Randall M, in proceedings of the CARTS USA 2000 symposium (Huntington Beach, CA, March, 2000), 195 (2000). (2000)
  3. Sakabe Y, Takeshima Y, Tanaka K, J. Electroceram., 3, 115 (1999)
  4. Mustofa S, Araki T, Furusawa T, Nishida M, Hino T, Mater. Sci. Eng. B, 103, 128 (2003)
  5. Sakabe Y, Ceramics, (in Japan), 36, 407 (2001)
  6. Joshi PC, Desu SB, Thin Solid Films, 300(1-2), 289 (1997)
  7. Markovic S, Mitric M, Cvjeticanin N, Uskokovic D, J. Eur. Ceram. Soc., 27, 505 (2007)
  8. Steinhausen R, Kouvatov A, Beige H, Langhammer HT, Abicht HP, J. Eur. Ceram. Soc., 24, 1677 (2004)
  9. Mueller V, Jager L, Beige H, Abicht HP, Muller T, Solid State Commun., 129, 757 (2004)
  10. Zarate RA, Kabrera AL, Volkman UG, Fuenzalida V, J. Phys. Chem. Solids, 59, 1639 (1998)
  11. Feuersanger AE, Hagenlocher AK, Solomon AL, J. Electrochem. Soc., 111, 1387 (1964)
  12. Park SS, Ha JH, Wadley HN, Integrated Ferroelectrics, 99, 105 (2008)
  13. Ding SW, Chai J, Feng CY, Mater. Lett., 60, 3241 (2006)
  14. Bak W, Kajtoch C, Starzyk F, Mater. Sci. Eng. B, 100, 9 (2003)
  15. Kajtoch C, Mater. Sci. Eng. B, 64, 25 (2003)
  16. Kumar A, Singh BP, Choudhary RNP, Thakur AK, Mater. Lett., 59, 1880 (2005)
  17. Dietz GW, Schumacher M, Waser R, Streiffer SK, Basceri C, Kingon AI, J. Appl. Phys., 82, 2359 (1997)
  18. Wei Z, Noda M, Okuyama M, Jpn. J. Appl. Phys., 41, 6619 (2002)
  19. Shu N, Kumar A, Alam MR, Chan HL, You Q, Appl. Surf. Sci., 109, 366 (1997)