인쇄회로기판용 solder resist의 해상성과 밀착력

최성호; 황성진; 김형순; Sungho Chol; Seongjin Hwang; Hyungsun Kim

Korean Journal of Materials Research, Vol.17, No.12, 676-681, December, 2007

DOI10.3740/MRSK.2007.17.12.676 Export Citation

인쇄회로기판용 solder resist의 해상성과 밀착력

Resolution and Adhesion Properties of Solder Resist for Printed Circuit Board

최성호, 황성진, 김형순^†

인하대학교 신소재공학부

Sungho Chol, Seongjin Hwang, and Hyungsun Kim^†

School of Materials Engineering, Inha University, 253, Yunghyun-dong, Nam-gu Incheon, 402-751, Korea

E-mail:

According to progress rapidly digitalization, networked and mobilization of electronics industry, there are demands for being smaller, thinner, more light, and more efficient complex functions of electronic devices which are wireless devices, semi-conductors, packages and mobile devices. Therefore, the solder resist on a printed circuit board have been required with the high resolution and the eco-friendly materials in the surface treatments such as high heating process and coating process with electrolysis. In this study, the photoinitiator initiator and monomers of the solder resist were prepared with their contents for reducing the occurrence of the under-cut. We investigated the sample surface by UV/VIS spectrometer, FT-IR, OM after HASL and ENIG process. From our results, it is possible to get a high adhesion of resist with optimal contents between the photoinitiator initiator and monomers after surface treatments.

Keywords:Solder resist;PCB;Photo polymerization;FT-IR

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[5] Lee WB, Bang KS, Yeun YM, Jung SB, Kor. J. Welding & Joining Soc., 20(5), 87 (2002)

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[10] Lee DJ, Lee KK, Lee JJ, Kor. J. Institute of Metals, 34(5), 603 (1996)