Sn-3.0 Ag-0.5 Cu/OSP 무연솔더 접합계면의 접합강도 변화에 따른 전자부품 열충격 싸이클 최적화

홍원식; 김휘성; 송병석; 김광배; Won Sik Hong; Whee Sung Kim; Byeong Suk Song; Kwang-Bae Kim

Korean Journal of Materials Research, Vol.17, No.3, 152-159, March, 2007

DOI10.3740/MRSK.2007.17.3.152 Export Citation

Sn-3.0 Ag-0.5 Cu/OSP 무연솔더 접합계면의 접합강도 변화에 따른 전자부품 열충격 싸이클 최적화

Thermal Shock Cycles Optimization of Sn-3.0 Ag-0.5 Cu/OSP Solder Joint with Bonding Strength Variation for Electronic Components

홍원식^†, 김휘성¹, 송병석, 김광배¹

전자부품연구원 신뢰성평가센터
¹한국항공대학교 항공재료공학과

Won Sik Hong^†, Whee Sung Kim¹, Byeong Suk Song, and Kwang-Bae Kim¹

Reliability and Failure Anaylysis Center, Korea Electronics Technology Institute, Gyeonggi, 463-816, Korea
¹Department of Materials Engineering, Hankuk Aviation University, Gyeonggi, 412-791, Korea

E-mail:

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

Keywords:Pb-free solder;thermal shock;Sn-3.0 Ag-0.5 Cu;reliability;intermetallic compounds

[References]

Kim JW, Kim DG, Hong WS, Jung SB, J. Elec. Mater., 34(12), 1550 (2005)
Yoon JW, Jung SB, J. Alloys and Compounds, 396, 122 (2005)
Kim DG, Kim JW, Lee JG, Morib H, Quesnel DJ, Jung SB, J. Alloys and Compounds, 395, 80 (2005)
Yoon JW, Kim SW, Jung SB, J. Alloys and Compounds, 392, 247 (2005)
Yoon JW, Kim SW, Jung SB, J. Alloys and Compounds, 391, 82 (2005)
Yoon JW, Kim DG, Jung SB, Microelectron. Reliab., 46, 535 (2006)
Gur C, Bamberger M, Acta Mater., 46(14), 4917 (1998)
Chen CJ, Lin KL, J. Elec. Mater., 29, 1007 (2000)
Hong WS, Kim KB, Korean J. Mater. Res., 15(8), 536 (2005)
Suganuma K, Lead free soldering in electronics, p.57, Marcel Dekker Inc., New York (2004) (2004)
JEITA, Lead Free Soldering Tech., Corona Pub. Co. Ltd., Tokyo (2003) (2003)
Tu KN, Yeh CC, Liu CY, Chen C, Appl. Phys. Lett., 76, 988 (2000)
Strauss R, SMT Soldering Handbook, 2nd ed., p.148, Newnes, Oxford (1998) (1998)

[Referenced By]

[1] Kim JW, Kim DG, Hong WS, Jung SB, J. Elec. Mater., 34(12), 1550 (2005)

[2] Yoon JW, Jung SB, J. Alloys and Compounds, 396, 122 (2005)

[3] Kim DG, Kim JW, Lee JG, Morib H, Quesnel DJ, Jung SB, J. Alloys and Compounds, 395, 80 (2005)

[4] Yoon JW, Kim SW, Jung SB, J. Alloys and Compounds, 392, 247 (2005)

[5] Yoon JW, Kim SW, Jung SB, J. Alloys and Compounds, 391, 82 (2005)

[6] Yoon JW, Kim DG, Jung SB, Microelectron. Reliab., 46, 535 (2006)

[7] Gur C, Bamberger M, Acta Mater., 46(14), 4917 (1998)

[8] Chen CJ, Lin KL, J. Elec. Mater., 29, 1007 (2000)

[9] Hong WS, Kim KB, Korean J. Mater. Res., 15(8), 536 (2005)

[10] Suganuma K, Lead free soldering in electronics, p.57, Marcel Dekker Inc., New York (2004) (2004)

[11] JEITA, Lead Free Soldering Tech., Corona Pub. Co. Ltd., Tokyo (2003) (2003)

[12] Tu KN, Yeh CC, Liu CY, Chen C, Appl. Phys. Lett., 76, 988 (2000)

[13] Strauss R, SMT Soldering Handbook, 2nd ed., p.148, Newnes, Oxford (1998) (1998)