공정조성 SnPb Solder 합금의 부식 및 Electrochemical Migration 특성에 미치는 SO42- 이온의 영향

정자영; 유영란; 이신복; 김영식; 주영창; 박영배; Ja-Young Jung; Young-Ran Yoo; Shin-Bok Lee; Young-Sik Kim; Young-Chang Joo; Young-Bae Park

Korean Journal of Materials Research, Vol.17, No.1, 43-49, January, 2007

DOI10.3740/MRSK.2007.17.1.043 Export Citation

공정조성 SnPb Solder 합금의 부식 및 Electrochemical Migration 특성에 미치는 SO42- 이온의 영향

Effect of SO42- Ion on Corrosion and Electrochemical Migration Characteristics of Eutectic SnPb Solder Alloy

정자영, 유영란, 이신복¹, 김영식, 주영창¹, 박영배^†

안동대학교 신소재공학부
¹서울대학교 재료공학부

Ja-Young Jung, Young-Ran Yoo, Shin-Bok Lee¹, Young-Sik Kim, Young-Chang Joo¹, and Young-Bae Park^†

School of Materials Science and Engineering, Andong National University, Andong 760-749, Korea
¹School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea

E-mail:

Electrochemical migration phenomenon is correlated with ionization of anode electrode, and ionization of anode metal has similar mechanism with corrosion phenomenon. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Sn Ivas primarily ionized in solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for electrochemical migration resistance of solder alloys.

Keywords:electrochemical migration;solder;SnPb;polarization

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[3] Harsanyi G, IEEE Trans. Compon. Packaging, Manufact. Tecnol, Part A, 18(3), 602 (1995)

[4] Yalamanchili P, Al-Sheikhly M, Christou A, IEEE International Reliability Physics Symposium, 34th Annual Proceedings, 258 (1996) (1996)

[5] Ready WJ, Turbini LJ, Stock SR, Smith BA, IEEE International Reliability Physics Symposium, 34th Annual Proceedings, 267 (1996) (1996)

[6] Shitamoto H, Nagatani T, J. Phys. D: Appl. Phys, 31, 1137 (1998)

[7] Harsanyi G, IEEE Electron Device Lett., 20(1), 5 (1999)

[8] Ready WJ, Turbini LJ, J. Eletron. Mater, 31(11), 1208 (2002)

[9] Lee SB, Yoo YR, Jung JY, Park YB, Kim YS, Joo YC, Thin Solid Films, 504(1-2), 294 (2006)

[10] Takemoto T, Latanisioni RM, Eagart TW, Matsunawa A, Corros. Sci., 39(8), 1415 (1997)

[11] Jung JY, Lee SB, Yoo YR, Kim YS, Joo YC, Park YB, J. Microelectronics & Packaging Soc., 13(3), 1 (2006)

[12] Simon P, Bui N, Pebere N, Dabosi F, Albert L, J. Power Sources, 55, 63 (1995)

[13] Hack HP, Metals Handbook, 13, Corrosion, 9th ed, ASM, Metals Park, OH (1987) (1987)

[14] Simson P, Bui N, Pebere N, Dabosi F, J. Power Sources, 53, 163 (1995)

[15] Abd El Aal EE, J. Power Sources, 75(1), 36 (1998)

[16] El-Sherbini EF, El Rehim SSA, Mater. Chem. Phys., 88(1), 17 (2004)