액상-환원법으로 합성된 Cu 분말의 특성에 미치는 분산제의 영향

김용이; 김태완; 박홍채; 윤석영; Yong-Yee Kim; Tea-Wan Kim; Hong-Chae Park; Seog-Young Yoon

Korean Journal of Materials Research, Vol.17, No.1, 50-55, January, 2007

DOI10.3740/MRSK.2007.17.1.050 Export Citation

액상-환원법으로 합성된 Cu 분말의 특성에 미치는 분산제의 영향

Effect of Dispersant on the Characterization of Cu Powders Prepared with Wet-reduction Process

김용이, 김태완, 박홍채 , 윤석영 ^†

부산대학교 재료공학부

Yong-Yee Kim, Tea-Wan Kim, Hong-Chae Park , and Seog-Young Yoon^†

School of Materials Science and Engineering, Pusan National University, Busan, 609-735, Korea

E-mail:

Ultra-fine Copper powder for a conductive paste in electric-electronic field have been synthesized by chemical reduction of aqueous with hydrazine hydrate as a reductor. The effect of reaction conditions such as dispersant and reaction temperature on the particle size and shape for the prepared Cu powders was investigated by means of XRD, SEM, TEM and TGA. Experiments showed that type of dispersant and reaction temperature were affected on the particle size and morphology of the copper powder. When the carboxymethyl cellulose (CMC) was added as a dispersant the relative mono-dispersed and spherical Cu powder was obtained. Cu powders with particle size of approximately 140nm and narrow particle size distribution were obtained from 0.3M with adding of 0.03M CMC and 40ml at a reaction temperature of .

Keywords:Cu powder;Wet-reduction process;Dispersant;Hydrazine Hydrate

[References]

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Yu YT, Choi YY, Korean J. Mater. Res., 13(8), 524 (2003)
Wnag Q, Yang H, Shi J, Zou G, Mater. Sci. and Eng. A, 307, 190 (2001)
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Ayyappan S, Subbanna GN, Gopalan RS, Rao CN, Solid State Ion., 84(3-4), 271 (1996)
Kim KH, Lee YB, Choi EY, Park HC, Park SS, Mater. Chem. Phys., 86(2-3), 420 (2004)
Llett SM, Orroek A, Poon WCK, Pusey PN, Phys. Rev. E, 51, 1334 (1995)
Poon WCK, Selfe JS, Robertson MB, Llett SM, Pirie AD, Pusey PN, J. de Physique II, 3(7), 1075 (1993)
Biffis A, D'Archivio AA, Jerabek K, Schmid G, Corain B, Adv. Mater., 12(24), 1909 (2000)
Li M, Messing GL, in Ceramic powder Science Ⅲ, American Ceramic Society, Westerville., 129 (1990) (1990)

[Related Articles]

[1] Privman V, Goia DV, Park J, Matijevic E, J. Colloid Interface Sci., 213(1), 36 (1999)

[2] Yu YT, Choi YY, Korean J. Mater. Res., 13(8), 524 (2003)

[3] Wnag Q, Yang H, Shi J, Zou G, Mater. Sci. and Eng. A, 307, 190 (2001)

[4] Zhu X, Birringer R, Herr U, Gleiter H, Phys. Rev. B, 35, 9085 (1987)

[5] Yavri AR, Mater. Trans. JIM, 36, 228 (1995)

[6] Suryanarayana C, Processing and properties of Nano crystalline Materials, TMS, Warendale, PA (1996) (1996)

[7] Ayyappan S, Subbanna GN, Gopalan RS, Rao CN, Solid State Ion., 84(3-4), 271 (1996)

[8] Kim KH, Lee YB, Choi EY, Park HC, Park SS, Mater. Chem. Phys., 86(2-3), 420 (2004)

[9] Llett SM, Orroek A, Poon WCK, Pusey PN, Phys. Rev. E, 51, 1334 (1995)

[10] Poon WCK, Selfe JS, Robertson MB, Llett SM, Pirie AD, Pusey PN, J. de Physique II, 3(7), 1075 (1993)

[11] Biffis A, D'Archivio AA, Jerabek K, Schmid G, Corain B, Adv. Mater., 12(24), 1909 (2000)

[12] Li M, Messing GL, in Ceramic powder Science Ⅲ, American Ceramic Society, Westerville., 129 (1990) (1990)