정펄스 및 역펄스 방법을 이용하여 구리 전해도금 시 전착층의 표면 형상과 고유저항에 미치는 효과

우태균; 박일송; 설경원; Tae-Gyu Woo; Il-Song Park; Kyeong-Won Seol

Korean Journal of Materials Research, Vol.17, No.1, 56-59, January, 2007

DOI10.3740/MRSK.2007.17.1.056 Export Citation

정펄스 및 역펄스 방법을 이용하여 구리 전해도금 시 전착층의 표면 형상과 고유저항에 미치는 효과

Effect of Pulse and Pulse-Reverse Current on Surface Morphology and Resistivity of Electrodeposited Copper

우태균, 박일송, 설경원^†

전북대학교 공과대학 신소재공학부 및 공업기술연구센터

Tae-Gyu Woo, Il-Song Park, and Kyeong-Won Seol^†

Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University, Chonju, Chonbuk, 561-756, Korea

E-mail:

Recently, requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. In this study, we evaluated the surface morphology, crystal phase ana surface roughness of the copper film electrodeposited by pulse method without using additives. Homogeneous and dense copper crystals were formed on the titanium substrate, and the optimum condition was 25% duty cycle. Moreover, the surface roughness(Ra), , is the smallest value in this condition. It is thought that this copper foil is good for electromigration inhibition due to the preferential crystal growth of Cu (111)

Keywords:Electrodeposition;Copper foil;Pulse mode;Pulse-Revers current mode

[References]

Lee YK, O'keefe TJ, JOM, 40 (2002)
Hu CC, Wu CM, Surf. Coat. Technol., 176, 75 (2003)
Donepudi VS, Venkatachalapathy R, Ozernoyah PO, Johnson CS, Prakash J, Solid-State. Lett., C13, 4 (2001)
Whelan CM, Smyth MR, Barnes CJ, J. Electroanal. Chem., 441(1-2), 109 (1998)
Kudelski A, Janik-Czachor M, Bukowska J, Dolata M, Szurnrner A, J. Mol. Struct., 483, 245 (1999)
Danilov AI, Andersen JET, Molodkina EB, Polukarov YM, Moller P, Ulstrup J, Electrochim. Acta, 43, 733 (1997)
Ikemiya N, Miyaoko S, Hara S, Surf. Sci., 327, 261 (1995)
Chang SC, Shieh JM, Lin KC, Dai BT, Wang TC, Chen CF, Feng MS, Li YH, Lu CP, J. Vac. Sci. Technol. B, 19(3), 767 (2001)
Lashmore DS, Bennett LH, Schone HE, Gustafson P, Watson RE, Phys Rev. Lett., 48, 1760 (1982)
Ibl N, Puippe JC, Angerer HF, Surf. Technol., 6, 287 (1978)
Min BS, Chung WS, Kim IC, J. Kor. Inst. Met. & Mater., 40, 1281 (2002)
Paatsch W, Metallobrflache, 41, 39 (1987)
Budevski E, Staikov G, Lorenz WJ, Electrochemical Phase Formation and Growth, 273 (1996)
Chene O, Staikov G, Landolt D, Oberflache/Surface, 26, 45 (1985)
Lee HS, Kim HS, Lee CM, J. Kor. Inst. Met. & Mater., 39, 920 (2001)
Choo RTC, Toguri JM, El-sherik M, Erb U, J. Appl. Electrochem., 25, 384 (1994)

[Referenced By]

[1] Lee YK, O'keefe TJ, JOM, 40 (2002)

[2] Hu CC, Wu CM, Surf. Coat. Technol., 176, 75 (2003)

[3] Donepudi VS, Venkatachalapathy R, Ozernoyah PO, Johnson CS, Prakash J, Solid-State. Lett., C13, 4 (2001)

[4] Whelan CM, Smyth MR, Barnes CJ, J. Electroanal. Chem., 441(1-2), 109 (1998)

[5] Kudelski A, Janik-Czachor M, Bukowska J, Dolata M, Szurnrner A, J. Mol. Struct., 483, 245 (1999)

[6] Danilov AI, Andersen JET, Molodkina EB, Polukarov YM, Moller P, Ulstrup J, Electrochim. Acta, 43, 733 (1997)

[7] Ikemiya N, Miyaoko S, Hara S, Surf. Sci., 327, 261 (1995)

[8] Chang SC, Shieh JM, Lin KC, Dai BT, Wang TC, Chen CF, Feng MS, Li YH, Lu CP, J. Vac. Sci. Technol. B, 19(3), 767 (2001)

[9] Lashmore DS, Bennett LH, Schone HE, Gustafson P, Watson RE, Phys Rev. Lett., 48, 1760 (1982)

[10] Ibl N, Puippe JC, Angerer HF, Surf. Technol., 6, 287 (1978)

[11] Min BS, Chung WS, Kim IC, J. Kor. Inst. Met. & Mater., 40, 1281 (2002)

[12] Paatsch W, Metallobrflache, 41, 39 (1987)

[13] Budevski E, Staikov G, Lorenz WJ, Electrochemical Phase Formation and Growth, 273 (1996)

[14] Chene O, Staikov G, Landolt D, Oberflache/Surface, 26, 45 (1985)

[15] Lee HS, Kim HS, Lee CM, J. Kor. Inst. Met. & Mater., 39, 920 (2001)

[16] Choo RTC, Toguri JM, El-sherik M, Erb U, J. Appl. Electrochem., 25, 384 (1994)