티타늄 기지을 이용한 구리 전해도금 시 Arabic Gum 첨가제의 영향

우태규; 박일송; 이현우; 설경원; Tae-Gyu Woo; Il-Song Park; Hyun-Woo Lee; Kyeong-Won Seol

Korean Journal of Materials Research, Vol.16, No.12, 725-730, December, 2006

DOI10.3740/MRSK.2006.16.12.725 Export Citation

티타늄 기지을 이용한 구리 전해도금 시 Arabic Gum 첨가제의 영향

The Effect of Arabic Gum on the Copper Electrodeposition using Titanium Substrate

우태규, 박일송, 이현우, 설경원^†

전북대학교 공과대학 신소재공학부 및 공업기술연구센터

Tae-Gyu Woo, Il-Song Park, Hyun-Woo Lee, and Kyeong-Won Seol^†

Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University, Chonju, Chonbuk, 561-756, Korea

E-mail:

The purpose of this study is to identify the effect of additives during copper electrodeposition. Additives such as arabic gum, chloride ions and glue were used in this study. Electrochemical experiments allied to SEM and roughness examination were performed to characterize of the copper foil in the presence of additives. In the production of electrodeposited copper foil, the surface roughness and grain size of the copper foil can be controlled by addition additives. on this study, the more uniform and hemispherical copper crystals are during the initial stages, the smaller crystal size and surface roughness of copper foil are. The surface roughness of copper foil electrodeposited at the current density of 500 under galvanostatic mode for 60 seconds has a minimum value of 0.136 m when adding 2 ppm of arabic gum.

Keywords:Electrodeposition;Arabic gum;Chloride ions;Glue;Copper foil

[References]

Hu CC, We CM, Surface and Coatings Tech, 176, 75 (2003)
Donepudi VS, Venkatachalapathy R, Ozemoyah PO, Johnson CS, Prakash J, Electrochem. Solid-State. Lett., C13, 4 (2001)
Whelan CM, Smyth MR, Barnes CJ, J. Electroanal. Chem., 441(1-2), 109 (1998)
Kudelski A, Janik-Czachorb M, Bukowskaa J, Dolatab M, Szummer A, J. Mol. Struct., 483, 245 (1999)
Danilov AI, Andersen JET, Molodkina EB, Polukarov YM, Moller P, Ulstrup J, Electrochem. Acta, 43, 733 (1997)
Ikemiya N, Miyaoko S, Hara S, Surf. Sci., 327, 261 (1995)
Turner DR, Johnson GR, J. Electrochem. Soc., 109, 798 (1962)
Piret NL, JOM, 17 (2002)
Dutra AJB, O'keefe TJ, Copper 99-Cobre 99 International Conference, p.495, The Minerals, Metals & Materials Society. (1999)
Bonou L, Eyraud M, Denoyel R, Massiani Y, Electrochim. Acta, 47(26), 4139 (2002)
Stante P, JOM, 19 (2002)
Stelter M, Bombach H, Nesterov N, JOM, 32 (2002)
Dutra AJB, O'Keefe TJ, J. Appl. Electrochem., 29(10), 1217 (1999)

[1] Hu CC, We CM, Surface and Coatings Tech, 176, 75 (2003)

[2] Donepudi VS, Venkatachalapathy R, Ozemoyah PO, Johnson CS, Prakash J, Electrochem. Solid-State. Lett., C13, 4 (2001)

[3] Whelan CM, Smyth MR, Barnes CJ, J. Electroanal. Chem., 441(1-2), 109 (1998)

[4] Kudelski A, Janik-Czachorb M, Bukowskaa J, Dolatab M, Szummer A, J. Mol. Struct., 483, 245 (1999)

[5] Danilov AI, Andersen JET, Molodkina EB, Polukarov YM, Moller P, Ulstrup J, Electrochem. Acta, 43, 733 (1997)

[6] Ikemiya N, Miyaoko S, Hara S, Surf. Sci., 327, 261 (1995)

[7] Turner DR, Johnson GR, J. Electrochem. Soc., 109, 798 (1962)

[8] Piret NL, JOM, 17 (2002)

[9] Dutra AJB, O'keefe TJ, Copper 99-Cobre 99 International Conference, p.495, The Minerals, Metals & Materials Society. (1999)

[10] Bonou L, Eyraud M, Denoyel R, Massiani Y, Electrochim. Acta, 47(26), 4139 (2002)

[11] Stante P, JOM, 19 (2002)

[12] Stelter M, Bombach H, Nesterov N, JOM, 32 (2002)

[13] Dutra AJB, O'Keefe TJ, J. Appl. Electrochem., 29(10), 1217 (1999)