구리 전해도금 시 표면형상과 기계적 특성에 미치는 HEC효과

우태규; 박일송; 이현우; 설경원; Tae-Gyu Woo; Il-Song Park; Hyun-Woo Lee; Kyeong-Won Seol

Korean Journal of Materials Research, Vol.16, No.11, 710-714, November, 2006

DOI10.3740/MRSK.2006.16.11.710 Export Citation

구리 전해도금 시 표면형상과 기계적 특성에 미치는 HEC효과

The Effect of Hydroxy Ethyl Cellulose(HEC) on the Surface Morphology and Mechanical Characteristis of Copper Electrodeposition

우태규, 박일송, 이현우, 설경원^†

전북대학교 공과대학 신소재공학부 및 공업기술연구센터

Tae-Gyu Woo, Il-Song Park, Hyun-Woo Lee, and Kyeong-Won Seol^†

Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University, Chonju, Chonbuk, 561-756, Korea

E-mail:

The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).

Keywords:Electrodeposition;HEC;FPCB;Polyimide;Platinum

[References]

Kim SH, Lee DW, Chung KH, Korean J. Mater. Res., 9, 65 (1999)
Ramos MMD, Stoncham AM, Sutton AP, Acta metall. mater, 41, 2105 (1993)
Tummala RR, Rymaszewski EJ, Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, (1989) (1989)
Payne AP, Clemens BM, J. Mater. Res., 7, 1370 (1992)
Dirks AG, Van den Broek JJ, J. Vac. Sci. Technol. A, 3, 2618 (1985)
WangCJ, Chang CA, Farrel CE, Schrott AG, Appl, Phys. Lett., 62, 654 (1993)
Kim J, Wen SH, Yee D, J. Vac. Sci. Technol. A, 6, 2366 (1988)
Liang T, Liu YQ, Fu ZQ, Luo TY, Zhang KY, Thin Solid Films, 473(2), 247 (2005)
Yang CH, Lee SC, Wu JM, Lin TC, Appl. Surf. Sci., 252(5), 1818 (2005)
Vossen JL, Werner Kern, Thin film process Academc press, New York, San Francisco, London (1978) (1978)
Sartorelli ML, Schervenski AQ, Delatorre RG, Klauss P, Phys. stat. sol, 187, 91 (2001)
Haight R, White RC, Silverman BD, Ho PS, J. Vac. Sci. Technol., A, Vac. Surf. Films, 6, 2188 (1988)
Dunn DS, Grant JL, J. Vac. Sci. Technol., A, Vac. Surf. Films, 7, 253 (1989)
Kim SH, Na SW, Lee NE, Nam YW, Kim YH, Surf. Coat. Technol., 200, 2072 (2005)
Lee HS, Kim HS, Lee CM, J. Kor. Inst. Met. & Mater., 39, 920 (2001)
Fukada T, Hasegawa M, Toyda Y, Sato K, Nunoshita M, Kotani H, Jpn. Soc. Appl, Phys., 18 (1992)
Li J, Shacham-Diamond Y, Mayer JW, Colgan EG, Proc. VMIC Coference, 153 (1991)
Lee HJ, Ph.D. Thesis, P. 4, Seoul National University, Seoul (2003) (2003)
Kang HJ, Park PN, Park SJ, Choi SY, Electro. Technol. Res., 203, 8 (2003)

[Referenced By]

[1] Kim SH, Lee DW, Chung KH, Korean J. Mater. Res., 9, 65 (1999)

[2] Ramos MMD, Stoncham AM, Sutton AP, Acta metall. mater, 41, 2105 (1993)

[3] Tummala RR, Rymaszewski EJ, Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, (1989) (1989)

[4] Payne AP, Clemens BM, J. Mater. Res., 7, 1370 (1992)

[5] Dirks AG, Van den Broek JJ, J. Vac. Sci. Technol. A, 3, 2618 (1985)

[6] WangCJ, Chang CA, Farrel CE, Schrott AG, Appl, Phys. Lett., 62, 654 (1993)

[7] Kim J, Wen SH, Yee D, J. Vac. Sci. Technol. A, 6, 2366 (1988)

[8] Liang T, Liu YQ, Fu ZQ, Luo TY, Zhang KY, Thin Solid Films, 473(2), 247 (2005)

[9] Yang CH, Lee SC, Wu JM, Lin TC, Appl. Surf. Sci., 252(5), 1818 (2005)

[10] Vossen JL, Werner Kern, Thin film process Academc press, New York, San Francisco, London (1978) (1978)

[11] Sartorelli ML, Schervenski AQ, Delatorre RG, Klauss P, Phys. stat. sol, 187, 91 (2001)

[12] Haight R, White RC, Silverman BD, Ho PS, J. Vac. Sci. Technol., A, Vac. Surf. Films, 6, 2188 (1988)

[13] Dunn DS, Grant JL, J. Vac. Sci. Technol., A, Vac. Surf. Films, 7, 253 (1989)

[14] Kim SH, Na SW, Lee NE, Nam YW, Kim YH, Surf. Coat. Technol., 200, 2072 (2005)

[15] Lee HS, Kim HS, Lee CM, J. Kor. Inst. Met. & Mater., 39, 920 (2001)

[16] Fukada T, Hasegawa M, Toyda Y, Sato K, Nunoshita M, Kotani H, Jpn. Soc. Appl, Phys., 18 (1992)

[17] Li J, Shacham-Diamond Y, Mayer JW, Colgan EG, Proc. VMIC Coference, 153 (1991)

[18] Lee HJ, Ph.D. Thesis, P. 4, Seoul National University, Seoul (2003) (2003)

[19] Kang HJ, Park PN, Park SJ, Choi SY, Electro. Technol. Res., 203, 8 (2003)