CFD를 이용한 히트싱크의 열 해석

임송철; 이명호; 강계명; Song Chul Lim; Myung Ho Lee; Kae Myung Kang

Korean Journal of Materials Research, Vol.15, No.12, 829-832, December, 2005

DOI10.3740/MRSK.2005.15.12.829 Export Citation

CFD를 이용한 히트싱크의 열 해석

Thermal Analysis of Heat Sink Models using CFD simulation

임송철, 이명호 , 강계명 ^{1, †}

서울산업대학교 신소재공학과
¹서울산업대학교 기계설계자동화공학부

Song Chul Lim, Myung Ho Lee , and Kae Myung Kang^{1, †}

Department of Materials Science and Engineering, Seoul National University of Technology, Korea
¹School of Mechanical Design & Automation on Eng., Seoul National University, Korea

E-mail:

Thermal analysis of new designed heat-sink models was carried out according to the natural ana the forced convection using computational fluid dynamics(CFD). Heat resistance of wave type, top vented wave type and plate type of heat sink was compared with each other As the direction of fin and air flow are vertical(z-axis), it is shown that radiant heat performance of all of heat sinks was superior than other experimental conditions. Especially, the heat resistance of top vented wave heat sink was [Math Processing Error] (forced convection) and [Math Processing Error] (natural convection). The radiant heat performance of heat sink was increased with increasing the height of fin and the width of fin pitch.

Keywords:heat sink;CFD;heat resistance;radiant heat performance

[References]

Chien HC, Tseng MH, Wang CY, Chu CH, in Proceedings Seventeenth IEEE SEMI-THERM Symposium (2001 IEEE) 219 (2001)
Karimanal K, Nair R, in Proceedings 2000 Inter Society Conferer on Thermal Phenome (2000 IEEE) 308 (2000)
Madhusudau L, Avram BC, Heat Transfer Proceeding of 11th IHTC, 3, 501 (1998)
Morega AM, Bejan A, Numer. Heat Transf. A, 25, 373 (1994)
Dancer D, Pecht M, IEEE Trans. Reliability, 38, 199 (1989)
Jeon CD, Kim YK, Lee JY, Song SH, KSME Proceeding, 229 (1998)
Lim SC, Chang SY, Kim HT, Lee DH, Kang KM, Korean J. of Mater. Research, 14(7), 522 (2004)
Lim SC, Choi JU, Kang KM, Korean J. of Mater. Research, 14(11), 775 (2004)
Maranzanz G, Perry I, Maillet D, Rael S, International Journal of Thermal Sciences, 43(1) (2004)
Shankatullah H, Storr WR, Hansen BJ, Gaynes MA, Packaging and Manufacturing Technolog. Part A, 19(4), 486 (1996)
Lin SC, Chou CA, Apllied Thermal Engineering, 24(16), 2375 (2004)
Sparrow EM, Vemuri SB, J. Heat Transfer, 45(25), 4957 (2002)
Morega AM, Bejan A, Numerical Heat Transfer, 25, 373 (1994)

[Referenced By]

[Related Articles]

[1] Chien HC, Tseng MH, Wang CY, Chu CH, in Proceedings Seventeenth IEEE SEMI-THERM Symposium (2001 IEEE) 219 (2001)

[2] Karimanal K, Nair R, in Proceedings 2000 Inter Society Conferer on Thermal Phenome (2000 IEEE) 308 (2000)

[3] Madhusudau L, Avram BC, Heat Transfer Proceeding of 11th IHTC, 3, 501 (1998)

[4] Morega AM, Bejan A, Numer. Heat Transf. A, 25, 373 (1994)

[5] Dancer D, Pecht M, IEEE Trans. Reliability, 38, 199 (1989)

[6] Jeon CD, Kim YK, Lee JY, Song SH, KSME Proceeding, 229 (1998)

[7] Lim SC, Chang SY, Kim HT, Lee DH, Kang KM, Korean J. of Mater. Research, 14(7), 522 (2004)

[8] Lim SC, Choi JU, Kang KM, Korean J. of Mater. Research, 14(11), 775 (2004)

[9] Maranzanz G, Perry I, Maillet D, Rael S, International Journal of Thermal Sciences, 43(1) (2004)

[10] Shankatullah H, Storr WR, Hansen BJ, Gaynes MA, Packaging and Manufacturing Technolog. Part A, 19(4), 486 (1996)

[11] Lin SC, Chou CA, Apllied Thermal Engineering, 24(16), 2375 (2004)

[12] Sparrow EM, Vemuri SB, J. Heat Transfer, 45(25), 4957 (2002)

[13] Morega AM, Bejan A, Numerical Heat Transfer, 25, 373 (1994)