SnCu계 무연솔더의 Ni, P 첨가에 따른 분극거동

홍원식; 김휘성; 박성훈; 김광배; Won Sik Hong; Whee Sung Kim; Sung Hun Park; Kwang-Bae Kim

Korean Journal of Materials Research, Vol.15, No.8, 528-535, August, 2005

DOI10.3740/MRSK.2005.15.8.528 Export Citation

SnCu계 무연솔더의 Ni, P 첨가에 따른 분극거동

Polarization Behaviors of SnCu Pb-Free Solder Depending on the P, Ni, Addition

홍원식^{1, 2, †}, 김휘성¹, 박성훈¹, 김광배¹

¹한국항공대학교 항공재료공학과
²전자부품연구원 신뢰성평가센터

Won Sik Hong^{1, 2, †}, Whee Sung Kim¹, Sung Hun Park¹, and Kwang-Bae Kim¹

¹Department of Materials Engineering, Hankuk Aviation University, Gyeonggi, 412-791, Korea
²Reliability and Failure Analysis Center, Korea Electronics Tecnology Institute, Gyeonggi, 463-816, Korea

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It is inclined to increase that use of hazardous substances such as lead(Pb), mercury (Hg), cadmium(Cd) etc. are prohibited in the electronics according to environmental friendly policies of an advanced nation for protecting environment of earth. As this reasons, many researches for ensuring the reliability were proceeding in Pb free soldering process. n the flux remains on the PCB(printed circuit board) in the soldering process or the electronics exposed to corrosive environment, it becomes the reasons of breakdown or malfunction of the electronics caused by corrosion. Therefore in this studies we researched the polarization and Tafel properties of Sn40Pb and SnCu system solders based on the electrochemical theory. The experimental polarization curves were measured in distilled ionized water and 1 mole 3.5wt% NaCl electrolyte of 40 ? C , pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrodes, respectively. To observe the electrochemical reaction, polarization test was conducted from -250mV to +250mV. From the polarization curves composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density((cow). In these results, we compared the corrosion rate of SnPb and SnCu solders.

Keywords:SnCu;intermetallic compound;polarization;corrosion rate

[References]

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Kim KS, Huh SH, Suganuma K, Int. Conf. on Electronics Packaging, 89 (2002)

[1] Directive 2002/95/EC of the European Parliament and of the Council, Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, EU (2003) (2003)

[2] Jones DA, Principles and Prevention of Corrosion, Macmillan Pub. Company, New York, (1992) (1992)

[3] Fontama MG, Corrosion Eng., 3rd ed., McGraw-Hill Int. Ed., New York (1988) (1988)

[4] Ganesan S, Pecht M, Lead-free Eledtronics, 2004 ed., p. 197, CALCE ESPC Press, Maryland (2004) (2004)

[5] Strauss R, SMT Soldering Handbook, 2nd ed., p. 148, Newnes, Oxford (1998) (1998)

[6] Suganuma K, Lead free soldering in electronics, Marcel Dekker Inc. New York (2004) (2004)

[7] Hwang JS, Environment-friendly electronics: lead-free tech., Electrochemical Pub. LTD (2001) (2001)

[8] Lead free soldering project final report, JEITA, Tokyo (2000) (2000)

[9] JEITA, Lead Free Soldering Tech., Corona Pub. Co. Ltd., Tokyo (2003) (2003)

[10] Wagner C, Traund W, Z. Electrochem., 44, 391 (1938)

[11] Kim KS, Huh SH, Suganuma K, Int. Conf. on Electronics Packaging, 89 (2002)