화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Korean Journal of Materials Research, Vol.15, No.7, 465-472, July, 2005
DOI10.3740/MRSK.2005.15.7.465  Export Citation
연속 ECR-CVD 조업하에 RF-magnetron-sputter의 싸이클조업을 통해 PET위에 올려진 구리박막의 특성
Characteristic of Copper Films on PET Substrate Deposited by Cyclic Operation of RF-magnetron-sputtering Coupled with Continuous Operation of ECR-CVD
명종윤, 전법주1, 변동진, 이중기2, †
  • 고려대학교 재료공학과
  • 1한국과학기술원 나노환경연구센터
  • 2한국과학기술연구원 나노환경연구센터
JongYun Myung, Bupju Jeon1, Dongjin Byun2, and Joongkee Lee1, †
  • Department of Materials Science and Engineering, Korea university, Korea
  • 1Eco-nano Research Center, Korea Institute of Science & Technology, Korea
  • 2Department of Materials Science and Engineering, Korea University, Korea
E-mail:
Preparation of copper film on PET substrate was carried out by cyclic operation of RF-magnetron­sputtering under continuous operation of ECR-CVD. The purpose of this study is aimed to an increase in deposition rate with keeping excellent adhesion between copper film and PET. In order to optimize the sputtering time under continuous ECR-CVD, cyclic operation concept is employed. By changing parameters of cyclic operation such as split of e and cycle time of A, the characteristics and thickness of the deposited copper film are controlled. As [Math Processing Error] value increase, film thickness could confirm to increase and its surface resistivity value decreases. The highest adhesive strength appears at [Math Processing Error] and cycle time of 30 min. The uniformity of copper film shows [Math Processing Error] in our experimental range.
Keywords:Cyclic operation;ECR-CVD;RF magnetron sputter;Copper film
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