화학공학소재연구정보센터
Korean Journal of Materials Research, Vol.15, No.5, 301-305, May, 2005
게이트를 상정한 니켈 실리사이드 박막의 물성과 미세구조 변화
Property and Microstructure Evolution of Nickel Silicides for Poly-silicon Gates
E-mail:
We fabricated nickel silicide layers on whole non-patterned wafers from [Math Processing Error] /poly-Si(70 nm)mn(40 nm) structure by 40 sec rapid thermal annealing of [Math Processing Error] . The sheet resistance, cross-sectional microstructure, surface roughness, and phase analysis were investigated by a four point probe, a field emission scanning electron microscope, a scanning probe microscope, and an X-ray diffractometer, respectively. Sheet resistance was as small as [Math Processing Error] . even at the elevated temperature of [Math Processing Error] . The silicide thickness and surface roughness increased as silicidation temperature increased. We confirmed the nickel silicides iron thin nickel/poly-silicon structures would be a mixture of NiSi and [Math Processing Error] even at the [Math Processing Error] stable temperature region.
  1. Zantye PB, Kuman A, Sikder AK, Materials Science and Engineering, R45, 89 (2004)
  2. Li WD, Shin DW, Tomozawa M, Murarka SP, Thin Solid Films, 270(1-2), 601 (1995)
  3. Zhu SY, Yu HY, Chen JD, Whang SJ, Chen JH, Shen C, Zhu CX, Lee SJ, Li MF, Chan DSH, Yoo WJ, Du AY, Tung CH, Singh J, Chin A, Kwong DL, Solid-State Electron., 48(10-11), 1987 (2004)
  4. Efavi JK, Lemme MC, Mollenhauer T, Wahlbrink T, Bobek T, Wang D, Gottlob HDB, Kurz H, Microelectronics Engineering, 76, 354 (2004)
  5. Yeo YC, Thin Solid Films, 462-463, 34 (2004)
  6. Park CS, Cho BJ, Kwong DL, IEEE Electron Device Lett., 22(9), 444 (2003)
  7. Jagar S, Singh N, Mehta SS, Agrawal N, Samudra G, Baasubramanian N, Thin Solid Films, 462-463, 1 (2004)
  8. Wong HSP, Chan KK, Tuar Y, IEDM Tech. Dig., 427 (1997)
  9. Semiconductor Industry Association(SIA), the international technology roadmap for semiconductors, (2001) (2001)
  10. Pawlak MA, Kittl JA, Chamirian O, Veloso A, Lauwers A, Schram T, Maex K, Vantomme A, Microelectronic Engineering, 76, 349 (2004)
  11. De I, Johri D, Srivastava A, Osburn CM, Solid-State Electron., 44(6), 1077 (2000)
  12. Liew KP, Bernstein RA, Thompson CV, J. Mater. Res., 19, 676 (2004)
  13. Rivero C, Patrice, Gergaud, Thomas O, Froment B, Jaouen H, Microelectronic Engineering, 76, 318 (2004)
  14. Chen J, Colinge JP, Flandre D, Gillon R, Raskin JP, Vanhoenacker D, J. Electrochem. Soc., 144(7), 2437 (1997)
  15. Zhang H, Poole J, Eller R, Keefe M, J. Vac. Sci. Technol. A, 17(4), 1904 (1999)
  16. Jung Y, Cheong S, Song O, Korean J. Mater. Res., 14(6), 389 (2004)
  17. Murarka SP, J. Electrochem. Soc., 129, 293 (1982)