PCB의 금속 이온 마이그레이션 현상에 관한 연구

홍원식; 강보철; 송병석; 김광배; Won Sik Hong; Bo-Chul Kang; Byeong Suk Song; Kwang-Bae Kim

Korean Journal of Materials Research, Vol.15, No.1, 54-60, January, 2005

DOI10.3740/MRSK.2005.15.1.054 Export Citation

PCB의 금속 이온 마이그레이션 현상에 관한 연구

A Study on the Metallic ion Migration Phenomena of PCB

홍원식^{1, 2, †}, 강보철¹, 송병석¹, 김광배²

¹전자부품연구원 신뢰성평가센터
²한국항공대학교 항공재료공학과

Won Sik Hong^{1, 2, †}, Bo-Chul Kang¹, Byeong Suk Song¹, and Kwang-Bae Kim³

¹Reliability and Failure Analysis Center, Korea Electronics Tecnology Institute, Korea
²Department of Materials Engineering, Hankuk Aviation University
³Department of Materials Engineering, Hankuk Aviation University, Korea

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Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. ion migration phenomena has been observed in the field of exposing the specific environment and using for a long tin e. This study was evaluated the generation time of ion migration and was investigated properly test method through water drop test and high temperature high humidity test. Also we observed direct causes and confirmed generation mechanism of dendritic growth as we reproduced the ion migration phenomena. We utilized PCB(printed circuit board) having a comb pattern as follows 0.5, 1.0, 2.0 mm pattern distance. Cu, SnPb and Au were electroplated on the comb pattern. 6.5 V and 15 V were applied in the comb pattern and then we measured the electrical short time causing by ion migration. In these results, we examined a difference of ion migration time depending on pattern materials, applied voltage and pattern spacing of PCB conductor.

Keywords:ion migration;dendtritic growth;PCB;water drop test;reliability

[References]

The Institute for Interconnecting and Packaging Electronic Circuit, IPC-TR-476A Electrochemical Migration (1997) (1997)
The Institute for Interconnecting and Packaging Electronic Circuit, IPC-TM-650 Test Methods Manual (1973) (1973)
Fontana MG, Corrosion Engineering, 3rd ed., p.41, Bever MB, McGraw-Hill, New York, (1987) (1987)
Kin Y, ESPEC Technology Report, 2, 1 (1996)
Tanaka H, Aoki Y, Yamamoto S, Espec Technology Report, 4, 10 (1997)
Ohtori T, J. of Jpn. Inst. Interconnecting and Packaging Electronic Circuits, 10(2), 80 (1995)
Aoki Y, Tanaka H, Yamamoto S, Obata O, Espec Technology Report, 1, 16 (1996)
Krumbein SJ, IEEE Trans. Relr, 44, 539 (1995)
Tanaka H, Hiramatsu H, Kumekkawa K, Ueta F, Yoshihara S, Shirakashi T, J. of Jpn. Inst. Electronics Packaging, 5(2), 188 (2002)

[1] The Institute for Interconnecting and Packaging Electronic Circuit, IPC-TR-476A Electrochemical Migration (1997) (1997)

[2] The Institute for Interconnecting and Packaging Electronic Circuit, IPC-TM-650 Test Methods Manual (1973) (1973)

[3] Fontana MG, Corrosion Engineering, 3rd ed., p.41, Bever MB, McGraw-Hill, New York, (1987) (1987)

[4] Kin Y, ESPEC Technology Report, 2, 1 (1996)

[5] Tanaka H, Aoki Y, Yamamoto S, Espec Technology Report, 4, 10 (1997)

[6] Ohtori T, J. of Jpn. Inst. Interconnecting and Packaging Electronic Circuits, 10(2), 80 (1995)

[7] Aoki Y, Tanaka H, Yamamoto S, Obata O, Espec Technology Report, 1, 16 (1996)

[8] Krumbein SJ, IEEE Trans. Relr, 44, 539 (1995)

[9] Tanaka H, Hiramatsu H, Kumekkawa K, Ueta F, Yoshihara S, Shirakashi T, J. of Jpn. Inst. Electronics Packaging, 5(2), 188 (2002)