PET 기질의 전처리효과가 상온 ECR 화학증착법에 의해 증착된 구리박막의 계면접착력에 미치는 영향

현진; 전법주; 변동진; 이중기; Jin Hyun; Bupju Jeon; Dongjin Byun; Joongkee Lee

Korean Journal of Materials Research, Vol.14, No.3, 203-210, March, 2004

DOI10.3740/MRSK.2004.14.3.203 Export Citation

PET 기질의 전처리효과가 상온 ECR 화학증착법에 의해 증착된 구리박막의 계면접착력에 미치는 영향

Effects of Pretreatments of PET Substrate on the Adhesion of Copper Films Prepared by a Room Temperature ECR-MOCVD Method

현진^{1, 2}, 전법주², 변동진 ¹, 이중기 ^{2, †}

¹고려대학교 재료공학과
²한국과학기술연구원 나노환경연구센터

Jin Hyun^{1, 2}, Bupju Jeon³, Dongjin Byun¹, and Joongkee Lee^{3, †}

¹Department of Materials Science and Engineering, Korea University, Korea
²Eco-Nano Research Center, Korea Institute of Science and Technology
³Eco-Nano Research Center, Korea Institute of Science and Technology, Korea

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Effects of various pretreatments on the adhesion of copper-coated polymer films were investigated. Copper-coated polymer films were prepared by an electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) coupled with a DC bias system at room temperature. PET(polyethylene terephthalate) film was employed as a substrate material and it was pretreated by industrially feasible methods such as chromic acid, sand-blasting, oxygen plasma and ion-implantation treatment. Surface characterization of the copper-coated polymer film was carried out by AFM(Atomic Force Microscopy) and FESEM(Field Emission Scanning Electron Microscopy). Surface energy was calculated by based on the value of the contact angle measured. The adhesion of copper/PET films was determined by a pull-off test according to ASTM D-5179. It was found that suitable pretreatment of the PET substrate was required for obtaining good adhesion property between copper films and the substrate. In this study the highest adhesion was observed in sand-blasting, and then followed by those of acid and oxygen plasma treatment. However, the effect of surface energy was insignificant in our experimental range. This is probably due to compensating the difference in surface energy from various pretreatments by exposing substrate to ECR plasma for 5 min or longer at the early stage of the copper deposition. Therefore, it can be concluded that surface roughness of the polymer substrate plays an important role to determine the adhesion of copper-coated polymer for the deposition of copper by ECR-MOCVD.

Keywords:copper-coated polymer film;ECR-MOCVD;adhesion;pretreatment

[References]

De Bruyn K, Van Stappen M, De Deurwaerder H, Rouxhet L, Celis JP, Surf. Coat. Technol, 163-164, 710 (2003)
Silvain JF, Ehrhardt JJ, Thin Solid Films, 236(1-2), 230 (1993)
Romero-Sanchez MD, Pastor-Blas MM, Martin-Martinez JM, International Journal of Adhesion & Adhesives, 23, 49 (2003) (2003)
Baba K, Nagata S, Hatada R, Daikoku T, Hasaka M, Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 80-81, 297 (1993) (1993)
Peden CHF, Kidd KB, Shinn ND, J. Vac. Sci. Technol. A, 9, 1518 (1991)
Milde F, Goedicke K, Fahland M, Thin Solid Films, 279(1-2), 169 (1996)
Bertrand P, Lambert P, Travaly Y, Nuclear Instruments and Methods in Physics Research Section. B., 131, 71 (1997)
Wang WC, Kang ET, Neoh KG, Appl. Surf. Sci., 199(1-4), 52 (2002)
Burkstrand JM, J. Appl. Phys., 52, 4795 (1981)
Burkstrand JM, J. Vac. Sci. Technol., 20, 440 (1982)
Chou NJ, Tang CH, J. Vac. Sci. Technol. A, 2, 751 (1984)
Riester M, Bawulf S, Lugscheider E, Hilgers H, Surf. Coat. Technol., 116-119, 1179 (1999)
Fortunato E, Nunes P, Marques A, Costa D, Aguas H, Ferreira I, Costa MEV, Godinho MH, Almeida PL, Borges JP, Martins R,, Surf. Coat. Technol., 151-152, 247 (2002)
Stefan G, Tobias M, Rolf W, Surf. Coat. Technol., 169-170, 24 (2003)
Bertrand P, Lambert P, Travaly Y, Nucl. Instrum. Methods Phys. Res. B, 131, 71 (1997)
Schiller S, Kirchhoff V, Schiller N, Morgner H, Surf. Coat. Technol., 125, 354 (2000)
Owens DK, Wendt RC, J. Appl. Polym. Sci., 13, 1741 (1969)
Packham DE, International Journal of Adhesion & Adhesive, 23, 437 (2003)

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[1] De Bruyn K, Van Stappen M, De Deurwaerder H, Rouxhet L, Celis JP, Surf. Coat. Technol, 163-164, 710 (2003)

[2] Silvain JF, Ehrhardt JJ, Thin Solid Films, 236(1-2), 230 (1993)

[3] Romero-Sanchez MD, Pastor-Blas MM, Martin-Martinez JM, International Journal of Adhesion & Adhesives, 23, 49 (2003) (2003)

[4] Baba K, Nagata S, Hatada R, Daikoku T, Hasaka M, Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 80-81, 297 (1993) (1993)

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[8] Wang WC, Kang ET, Neoh KG, Appl. Surf. Sci., 199(1-4), 52 (2002)

[9] Burkstrand JM, J. Appl. Phys., 52, 4795 (1981)

[10] Burkstrand JM, J. Vac. Sci. Technol., 20, 440 (1982)

[11] Chou NJ, Tang CH, J. Vac. Sci. Technol. A, 2, 751 (1984)

[12] Riester M, Bawulf S, Lugscheider E, Hilgers H, Surf. Coat. Technol., 116-119, 1179 (1999)

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