화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Korean Journal of Materials Research, Vol.13, No.1, 6-10, January, 2003
DOI10.3740/MRSK.2003.13.1.006  Export Citation
LIGA-like 공정을 이용한 마이크로 부품 복제용 Ni과 Ni-W 금형 제조 및 특성
Fabrication and Properties of Ni and Ni-W Electroplated Molds Using LIGA-like Process for Replication of Micro Components
황완식1, 박준식2, 3, †, 강영철2, 조진우2, 박순섭2, 이인규1, 강성군3
  • 1한국항공대학교 항공재료공학과
  • 2전자부품연구원
  • 3한양대학교 재료공학과
W.S. Hwang1, J.S. Park2, 3, †, Y.C. Kang2, J.W. Cho2, S.S. Park2, I.G. Lee1, and S.G. Kang4
  • 1Dept. of Materials Engineering, Hankuk Aviation University, 412-791, Korea
  • 2Korea Electronics Technology Institute, 451-865, Korea
  • 3Dept. of Materials Engineering, Hankuk Aviation University, 133-791, Korea
  • 4Dept. of Materials Science and Engineering, Hanyang University, 133-791, Korea
E-mail:
Electroplated Ni and Ni-W micro-molds using LIGA-like process for replication of micro-components such as microfluidic parts and micro optical parts have been investigated. In general, it is hard to produce micro-parts using conventional mechanical processes. Micro-mold formed by LIGA-like process could fabricate micro-parts with high aspect ratio. In this paper, fabrication and properties of electroplated Ni molds with varying applied current types as well as those of Ni-W molds were investigated. Ni molds fabricated under pulse-reverse current showed the highest hardness value of about 160 Hv. Ni-W molds showed the hardness of about 500 Hv which was much harder than that of Ni electroplated molds. The above results suggested that high quality micro-molds could be fabricated by using Ni electroplating of pulse-reverse type for core molds and sequential Ni-W alloys coating.
Keywords:Micro-mold;Ni electroplating;Ni-W electroplating;replication process
  1. Marques C, Desta YM, Rogers J, Murphy MC, Kelly D, J. of microelectromechanical systems, 6, 4 (1997)
  2. Stephens LS, Kelly KW, Simhadri S, McCandless AB, Meletis EI, J. of microelectromechanical systems, 10, 347 (2001)
  3. Donten M, Cesiulis H, Stojek Z, Electrochim. Acta, 45(20), 3389 (2000)
  4. Benhenda S, Ben jemaa N, Bourir M, IEEE transactions on components, packaging and manufacturing technology-part A, 17, 303 (1994) (1994)
  5. Dieter GE, Mechanical Metallurgy, McGraw-Hill Book Co., 203 (1988) (1988)
  6. SchloBmacher P, Yamasaki T, Mikrochim. Acta, 132, 309 (2000)
  7. Yamasaki T, SchloBmacher P, Ehrlich K, Ogino Y, Nanostructured materials, 10, 375 (1998)
  8. Kim W, Lee CK, Lee J, Suh C, Korean J. Mater. Res., 8, 10 (1998)
  9. Sun TP, Wan CC, Shy YM, Met. Finishing, 77, 33 (1979)
  10. Hall WF, Chaudhuri AR, in AES 10th Symposium On Plating In The Electronics Industry, (1983) (1983)
  11. Dieter GE, Mechanical Metallurgy, McGraw-Hill Book Co., 108 (1988) (1988)
  12. Dieter GE, Mechanical Metallurgy, McGraw-Hill Book Co., 409 (1988) (1988)
  13. ASM Handbook, Vol. 3, Alloy Phase Diagrams, The Materials Information Society, ASM International, Materials Park, OH, 1992 (1992)
  14. Coble RL, Kingery WD, J. Am. Ceram. Soc., 39, 11 (1956)
  15. Dieter GE, Mechanical Metallurgy, McGraw-Hill Book Co., 189 (1988) (1988)