화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Korean Journal of Materials Research, Vol.12, No.9, 740-746, September, 2002
DOI10.3740/MRSK.2002.12.9.740  Export Citation
O 2 / Ar 플라즈마 처리에 의해 개질된 폴리카보네이트 기판에서 Cu의 밀착성
Adhesion of Cu on Polycarbonate Modified by O 2 / Ar Plasma Treatment
박준규†, 김동원, 김상호, 이연승1
  • 경기대학교 재료공학과
  • 1한밭대학교 정보통신컴퓨터공학부
Jun-Kyu Park†, Dong-Won Kim, Sang-Ho Kim, and Youn-Seoung Lee1
  • Department of Materials Engineering, Kyonggi University, Korea
  • 1Division of Information Communication & Compyter Engineering, Hanbat National University, 300-717, Korea
E-mail:
In this study, the polycarbonate surface was treated by O 2 / Ar gases plasma for the enhancement of adhesion with Cu electrode. From the point of view of hydrophilicity and the functionality, the micro-roughness, new functional groups and oxygen content of the polycarbonate surface were increased by the O 2 / Ar gases plasma treatment. The Cu films deposited on the as-received polycarbonate were easily detached while, after the O 2 / Ar gases plasma treatment the adhesive Cu films on polycarbonate could be obtained. These results can be explained that the polycarbonate had a hydrophilic surface with uniform micro-roughness and new functional groups by O 2 / Ar gases plasma treatment. Therefore, O 2 / Ar gases plasma treatment is a promising method for improvement of adhesion between polycarbonate and Cu electrode.
Keywords:plasma treatment;surface modification;polycarbonate;adhesion;surface functional group
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