CU Oxide 분산 및 환원에 의한 Al 2 O 3 /Cu 나노복합재료의 제조공정

고세진; 민경호; 강계명; 김영도; 문인형; Se Jin Ko; Kyung Ho Min; Kae-Myung Kang; Young Do Kim; In-Hyung Moon

Korean Journal of Materials Research, Vol.12, No.8, 656-660, August, 2002

DOI10.3740/MRSK.2002.12.8.656 Export Citation

CU Oxide 분산 및 환원에 의한 Al 2 O 3 /Cu 나노복합재료의 제조공정

Fabrication Process of Al 2 O 3 /Cu Nanocomposite by Dispersion and Reduction of Cu Oxide

고세진^†, 민경호, 강계명 ¹, 김영도 , 문인형

한양대학교 재료공학과, CPRC
¹서울산업대학교 신소재공학과

Se Jin Ko^†, Kyung Ho Min, Kae-Myung Kang¹, Young Do Kim , and In-Hyung Moon

Division of Materials Science and Engineering, CPRC, Hanyang University, Seoul 133-791, Korea
¹Department of Materials Engineering, Seoul National University of Technology, Seoul, 139-743, Korea

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It was investigated that Al 2 O 3 /Cu nanocomposite powder could be optimally prepared by dispersion and reduction of Cu oxide, and suitably consolidated by employing pulse electric current sintering (PECS) process. α - Al 2 O 3 and CuO powders were used as elemental powders. In order to obtain Al 2 O 3 embedded by finely and homogeneously dispersed CuO particles, the elemental powders were high energy ball milled at the rotating speed of 900 rpm, with the milling time varying up to 10 h. The milled powders were heat treated at 350 ? C in H 2 atmosphere for 30 min to reduce CuO into Cu. The reduced powders were subsequently sintered by employing PECS process. The composites sintered at 1250 ? C for 5 min showed the relative density of above 98%. The fracture toughness of the Al 2 O 3 /Cu nanocomposite was as high as 4.9MPa. m 1 2//, being 1.3 times the value of pure Al 2 O 3 sintered under the same condition.

Keywords:nonocomposite;high energy ball milling;hydrogen reduction;fracture toughness

[References]

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Sekino T, Nakajima T, Ueda S, Niihara K, J. Am. Ceram. Soc., 80(5), 1139 (1997)
Sekino T, Niihara K, Nanostruct. Mater., 6(5-8), 663 (1995)
Oh ST, Sekino T, Niihara K, Nanostruct. Mater., 10(2), 267 (1998)
Sekino T, Niihara K, J. Mater. Sci., 32(15), 3943 (1997)
Benjamin JS, Metall. Trans., 1, 2943 (1970)
Oh ST, Sekino T, Niihara K, J. Europ. Ceram. Soc., 18(1), 31 (1998)
Bennison SJ, Harmer MP, J. Am. Ceram. Soc., 68, C22 (1985)
Oh ST, Lee JS, Niihara K, J. Kor. Pow. Metall. Ins., 7(4), 213 (2000)
Anstis GR, Chantikul P, Lawn BR, Marshall DB, J. Am. Ceram. Soc., 64, 533 (1981)
Kitayama M, Pask JA, J. Am. Ceram. Soc., 79, 2003 (1996)
Williamson GK, Hall WH, Acta Metall., 1, 22 (1953)
Min KH, Hong DH, Kim DG, Kim YD, Moon IH, J. Kor. Pow. Metall. Ins., 7(3), 149 (2000)
Li G, Jiang A, Zhang L, J. Mater. Sci. Lett., 15(19), 1713 (1996)

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[1] Sternitzke M, Knechtel M, Hoffman M, Broszeit E, Rodel J, J. Am. Ceram. Soc., 79(1), 121 (1996)

[2] Sekino T, Nakajima T, Ueda S, Niihara K, J. Am. Ceram. Soc., 80(5), 1139 (1997)

[3] Sekino T, Niihara K, Nanostruct. Mater., 6(5-8), 663 (1995)

[4] Oh ST, Sekino T, Niihara K, Nanostruct. Mater., 10(2), 267 (1998)

[5] Sekino T, Niihara K, J. Mater. Sci., 32(15), 3943 (1997)

[6] Benjamin JS, Metall. Trans., 1, 2943 (1970)

[7] Oh ST, Sekino T, Niihara K, J. Europ. Ceram. Soc., 18(1), 31 (1998)

[8] Bennison SJ, Harmer MP, J. Am. Ceram. Soc., 68, C22 (1985)

[9] Oh ST, Lee JS, Niihara K, J. Kor. Pow. Metall. Ins., 7(4), 213 (2000)

[10] Anstis GR, Chantikul P, Lawn BR, Marshall DB, J. Am. Ceram. Soc., 64, 533 (1981)

[11] Kitayama M, Pask JA, J. Am. Ceram. Soc., 79, 2003 (1996)

[12] Williamson GK, Hall WH, Acta Metall., 1, 22 (1953)

[13] Min KH, Hong DH, Kim DG, Kim YD, Moon IH, J. Kor. Pow. Metall. Ins., 7(3), 149 (2000)

[14] Li G, Jiang A, Zhang L, J. Mater. Sci. Lett., 15(19), 1713 (1996)