사점굽힘시험법을 이용한 이종절연막 (Si/SiO 2 ||Si 3 N 4 /Si) SOI 기판쌍의 접합강도 연구

이상현; 송오성; Sang Hyun Lee; Oh Sung Song

Korean Journal of Materials Research, Vol.12, No.6, 508-512, June, 2002

DOI10.3740/MRSK.2002.12.6.508 Export Citation

사점굽힘시험법을 이용한 이종절연막 (Si/SiO 2 ||Si 3 N 4 /Si) SOI 기판쌍의 접합강도 연구

Direct Bonded (Si/SiO 2 ∥Si 3 N 4 /Si) SIO Wafer Pairs with Four-point Bending

이상현^†, 송오성

서울시립대학교 재료공학과

Sang Hyun Lee^†, and Oh Sung Song

Department of Materials Science and Engineering, The University of Seoul, Korea

E-mail:

2000/AA?SiO 2 /Si(100) and 560AA/Si 3 N 4 /Si(100) wafers, which are 10 cm in diameter, were directly bonded using a rapid thermal annealing method. We fixed the anneal time of 30 second and varied the anneal temperatures from 600 to 1200 ? C . The bond strength of bonded wafer pairs at given anneal temperature were evaluated by a razor blade crack opening method and a four-point bonding method, respectively. The results clearly slow that the four-point bending method is more suitable for evaluating the small bond strength of 80~430 mJ/ /m 2 compared to the razor blade crack opening method, which shows no anneal temperature dependence in small bond strength.

Keywords:direct bonding;(Si/SiO 2 ∥Si 3 N 4 /Si) wafer pains;rapid thermal annealing;four-point bonding method;razor blade crack opening method

[References]

Shimbo M, Furukawa K, Fukuda K, Tanzawa K, J. Appl. Phys., 60(8), 2987 (1986)
Lasky JB, Appl. Phys. Lett., 48, 78 (1986)
Tong QY, Goesele U, Science and Technology, New York, John Wiley & Sons, (1999) (1999)
Lehmann V, Mitani K, Stengl R, Mii T, Goesele U, Jpn. J. Appl. Phys., 28(12), L2141 (1989)
Bruel M, Aspar B, Auberton-Herve AJ, Jpn. J. Appl. Phys., 36, 1636 (1997)
Lee JW, PhD. thesis, Seoul National University, (1999) (1999)
Song OS, Lee YM, Lee SH, Lee JW, Kang CS, J. Korean Institute of Surface Engineering., 34(1), 33 (2001)
Matsuo N, Nakata Y, Okada S, J. Appl. Phys., 70(10), 5085 (1991)
Jensen BD, de Boer MP, Masters ND, Bitsie P, LaVan DA, J. Micro. Systems, 10, 336 (2001)
Zahn JD, Deshmukh AA, Pisano AP, Liepmann DJ, Micro. Systems, 503 (2001)
Robertson J, Powell MJ, Apply. Phys. Lett., 44, 415 (1984)
Maszara WP, Goetz G, Caviglia A, McKitterick JB, J. Appl. Phys., 64, 4943 (1998)
Abe T, Takei T, Uchiyama A, Yoshizawa K, Nakazato Y, Jpn. J. Appl. Phys., 29, L2311 (1990)
Muller B, Stoffel A, J. Micromech. Microeng., 1, 125 (1991)
Farrens SN, Hunt CE, Roberds BE, Smith JK, J. Electrochem. Soc., 141(11), 3225 (1994)
Dauskardt RH, Lane M, Ma Q, Krishna N, Engineering Fracture Mechanics, 61, 141 (1998)
Lee JK, Mechanical Properties of Ceramics, Seoul, Bando, (1994) (1994)
Lee SH, Yi SD, Seo TY, Song OS, Korean J. Materials Research, 12(2), 117 (2001)
Martini T, Steinkirchner J, Gosele U, J. Electrochem. Soc., 144(1), 354 (1997)

[Related Articles]

[1] Shimbo M, Furukawa K, Fukuda K, Tanzawa K, J. Appl. Phys., 60(8), 2987 (1986)

[2] Lasky JB, Appl. Phys. Lett., 48, 78 (1986)

[3] Tong QY, Goesele U, Science and Technology, New York, John Wiley & Sons, (1999) (1999)

[4] Lehmann V, Mitani K, Stengl R, Mii T, Goesele U, Jpn. J. Appl. Phys., 28(12), L2141 (1989)

[5] Bruel M, Aspar B, Auberton-Herve AJ, Jpn. J. Appl. Phys., 36, 1636 (1997)

[6] Lee JW, PhD. thesis, Seoul National University, (1999) (1999)

[7] Song OS, Lee YM, Lee SH, Lee JW, Kang CS, J. Korean Institute of Surface Engineering., 34(1), 33 (2001)

[8] Matsuo N, Nakata Y, Okada S, J. Appl. Phys., 70(10), 5085 (1991)

[9] Jensen BD, de Boer MP, Masters ND, Bitsie P, LaVan DA, J. Micro. Systems, 10, 336 (2001)

[10] Zahn JD, Deshmukh AA, Pisano AP, Liepmann DJ, Micro. Systems, 503 (2001)

[11] Robertson J, Powell MJ, Apply. Phys. Lett., 44, 415 (1984)

[12] Maszara WP, Goetz G, Caviglia A, McKitterick JB, J. Appl. Phys., 64, 4943 (1998)

[13] Abe T, Takei T, Uchiyama A, Yoshizawa K, Nakazato Y, Jpn. J. Appl. Phys., 29, L2311 (1990)

[14] Muller B, Stoffel A, J. Micromech. Microeng., 1, 125 (1991)

[15] Farrens SN, Hunt CE, Roberds BE, Smith JK, J. Electrochem. Soc., 141(11), 3225 (1994)

[16] Dauskardt RH, Lane M, Ma Q, Krishna N, Engineering Fracture Mechanics, 61, 141 (1998)

[17] Lee JK, Mechanical Properties of Ceramics, Seoul, Bando, (1994) (1994)

[18] Lee SH, Yi SD, Seo TY, Song OS, Korean J. Materials Research, 12(2), 117 (2001)

[19] Martini T, Steinkirchner J, Gosele U, J. Electrochem. Soc., 144(1), 354 (1997)