For the tight closure of ceramic heat pipes, SSiC-to-SSiC bonds were created by high-temperature soldering. The glass solder was heated by diode laser irradiation with a combination of different wavelengths focusing on the joining seam. The design of suitable glass solders belonging to the Y2O3-Al2O3-SiO2 and the MgO-Al2O3-SiO2 material systems is discussed as well as the optimization of the joining process. Regarding potential applications for heat recovery in gasification processes, first experimental results obtained by high-temperature annealing of soldered ceramic-glass bonds are presented.