The development of devices to remove increased power density - that is, with enhanced cooling capability per unit area - is a very relevant problem in thermal management. It is highly desirable that these devices cool hot surfaces as uniformly as possible. A non-uniform temperature distribution may cause several problems, such as deterioration of the material being cooled or degradation or vaporization of the coolant which is being heated. In this paper the temperature distribution inside a Lytron CP20 microchannel cold plate under constant heat flux is analyzed. The cooling fluid is DI water. The pressure, velocity, and temperature at the inlet and outlet of the cold plate are experimentally measured in two coolant loops. In addition, the problem is modeled numerically using the Star CCM+ software. The Reynolds-Averaged Navier-Stokes (RANS) equations coupled with the realizable k-epsilon model as closure were used for this simulation. The objective of this study is to evaluate the uniformity of the temperature profile inside the cold plate. Pressure, velocity, and temperature profiles are presented and compared with experimental results. Regions of especially high or low temperature are highlighted and discussed. Suggestions on how to obtain a more uniform temperature distribution inside the cold plate are presented. Critical details on the modeling and on the limitations of the model are also discussed. The high-performance computing facility at Wright-Patterson Air Force Base was used for this research. (C) 2014 Elsevier Ltd. All rights reserved.