A model is developed to simulate electrodeposition of copper onto a rotating disk electrode from cuprous cyanide electrolyte used for strike plating of copper. The effects of multiple electrode reactions, homogeneous complexation equilibria, and mass transport by diffusion, migration, and convection are considered. The model elucidates the influence of solution composition, transport properties, kinetic constants, and convective flow on current distribution and polarization characteristics. Except at extremely low rotation rates (e.g. < 5 rpm for a 0.25 cm disk radius): (i) deposits tend to be less uniform with increasing rotation rate at a given potential because mass-transfer resistance becomes increasingly less important than ohmic, and (ii) the current distribution is most non-uniform at an intermediate fraction of the mass-transport-limited current, where kinetic and mass-transport resistances are small relative to ohmic resistances. As the electrode rotation rate is increased from zero, the limiting current distribution varies from a highly non-uniform primary-like distribution to one which is nearly uniform; the migration flux effects a preferential deposition near the disk perimeter that disturbs the otherwise uniform convective-diffusion-limited distribution. The distribution of copper-containing species shifts towards higher-order complexes with cyanide near the cathode surface, and the resulting diffusion potential causes the solution potential to increase. The shift towards higher-order complexes is more pronounced at the disk edge than center, and it has a leveling effect on the current distribution. Because of the diffusion potential, mass-transport of anionic complexes by migration increases the current density at a given applied potential.