Cu-Sn alloy foams were produced by electrodeposition in a 0.5 M sulfuric acid solution using a porous polyurethane (PU) template. A thin seed layer of Ti/Ni was sputter-deposited on the PU template. The sulfuric acid solution contained 10 mM Cu and 1 mMSn to electrodeposit Cu-Sn alloy under diffusion-controlled condition. The effect of the solution temperature on the chemical composition, microstructure, and electrical resistivity of Cu-Sn alloy foams was fundamentally investigated. Increasing the solution temperature has reduced cathodic overpotential for alloy reduction, resulting in improved reduction rate and deposition efficiency of Cu-Sn alloy. Thermal treatment for the removal of the PU template contributed to the microstructural recovery of as-electrodeposited Cu-Sn alloy. Electrical resistivity of Cu-Sn alloy foams was measured using a Ag-wired plastic holder. Their relatively low values, compared to theoretically predicted values, were resulted from the formation of intermetallic compounds within Cu-Sn alloy foam. (C) The Author(s) 2014. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial No Derivatives 4.0 License (CC BY-NC-ND, http://creativecommons.org/licenses/by-nc-nd/4.0/), which permits non-commercial reuse, distribution, and reproduction in any medium, provided the original work is not changed in any way and is properly cited. For permission for commercial reuse, please email: [email protected]. All rights reserved.