Impurities and defects are of significant interest in multicrystalline silicon, due to the detrimental effect they can have on carrier lifetimes and electrical properties. In view of that, it is important to incorporate certain processing steps to decrease the recombination activities. In this study, a novel experiment was applied as a beneficial approach to improve the electronic quality of low-resistivity mc-Si substrates via a two-step process. Initially, the first step involves gettering multicrystalline substrates using sacrificial porous silicon layer on both sides, which was introduced as a simple sequence for efficient extrinsic gettering schemes. The gettering experiment was performed at 600-900 degrees C, and optimum results were obtained at 900 degrees C. Then, the second step involves coating the front surface of gettered mc-Si at 900 degrees C with vanadium oxide that serves as an excellent antireflection layer and leads to improve furthermore the electrical properties. Significant improvements were obtained after the deposition of vanadium oxide antireflection coating, in view of the fact that gettered mc-Si substrate at 900 degrees C provides the highest minority carrier lifetime and the lowest effective surface recombination velocity. An overall increase of the electrical properties was obtained after the described two-step process. The conversion efficiency increases from 6% (reference) and reached 13.7%. (C) 2014 Elsevier Ltd. All rights reserved.