에폭시 수지계 의료용 고분자 재료의 특성 연구 - Kissinger 식과 Ozawa 식에 의한 DGEBA/MDA/PGE-DMU 계의 경화특성 -

김장훈; 이재영; 김상욱; 심미자; Jang-Hoon Kim; Jae-Young Lee; Sang-Wook Kim; Mi-Ja Shim

Korean Journal of Materials Research, Vol.11, No.9, 727-732, September, 2001

Characteristics of Medical Polymer Based on Epoxy Resin System -Cure Characteristics for DGEBA/MDA/PGE- DMU System by Kissinger and Ozawa Equations-

김장훈, 이재영¹, 김상욱, 심미자^{2, †}

서울시립대학교 화학공학과
¹(주)한양유화 기술연구소
²서울시립대학교 생명과학과

Jang-Hoon Kim, Jae-Young Lee¹, Sang-Wook Kim, and Mi-Ja Shim^{2, †}

Department of Chemical Engineering, The University of Seoul, Seoul, 130-743, Korea
¹Tech. Res. Center, Han Yang Petrochmical Co., Ltd., Kyungki 425-110, Korea
²Department of Life Science, The University of Seoul, Seoul, 130-743, Korea

E-mail:

The cure kinetics of diglycidyl ether of bisphenol A (DGEBA)/4,4'- methylene dianiline (MDA) system with synthesized phenyl glycidyl ether-dimethylurea (PGE-DMU) was studied by Kissinger and Ozawa equations with DSC analysis in the temperature range of 20 300 ? C To investigate the reaction mechanism between epoxy group of PGE and urea group of DMU, FT-lR spectroscopy analysis was used. The epoxide group of PGE reacted with the urea group of DMU and formed a hydroxyl group which acted as a catalyst on the cure reaction of other epoxide and amine groups. The activation energy of DGEBA/MDA system without PGE-DMU was 46.5 kJ/mol and those of the system with 5 and 10 phr of PGE- DMU were 43.4 and 37.0 kJ/mol, respectively. Ozawa method also showed the same tendency.

Keywords:epoxy;cure kinetics;Kissinger method;Ozawa method

[References]

Lee JY, Shim MJ, Kim SW, Mater. Chem. Phys., 48, 36 (1997)
Lee JY, Shim MJ, Kim SW, ibid., 44, 74 (1996)
Ozawa T, J. Therm. Anal., 2, 301 (1970)
Doyle CD, J. Appl. Polym. Sci., 6, 639 (1962)
Prime RB, “Thermal Characterization of Polymeric Materials" , Ed. Turi EA, Academic Press, New York (1982).
Lu MG, Shim MJ, Kim SW, Thermochim. Acta, 323(1-2), 37 (1998)
Vyazovkin S, Sbirrazzuoli N, Macromolecules, 29(6), 1867 (1996)
Cho CS, Fu SC, Chen LW, Wu TR, Polym. Int., 47, 203 (1998)
Guo QP, Polymer, 36(25), 4753 (1995)
Li YS, Li MS, Chang FC, J. Polym. Sci. A: Polym. Chem., 37, 8614 (1999)
Tanaka Y, Kakiuchi H, J. Appl. Polym. Sci., 7, 1063 (1963)
Mijovi J, Kim J, Slaby J, ibid., 29, 1449 (1984)
Lee JY, Shim MJ, Kim SW, Korean J. Mater. Res., 5, 667 (1995)

[1] Lee JY, Shim MJ, Kim SW, Mater. Chem. Phys., 48, 36 (1997)

[2] Lee JY, Shim MJ, Kim SW, ibid., 44, 74 (1996)

[3] Ozawa T, J. Therm. Anal., 2, 301 (1970)

[4] Doyle CD, J. Appl. Polym. Sci., 6, 639 (1962)

[5] Prime RB, “Thermal Characterization of Polymeric Materials" , Ed. Turi EA, Academic Press, New York (1982).

[6] Lu MG, Shim MJ, Kim SW, Thermochim. Acta, 323(1-2), 37 (1998)

[7] Vyazovkin S, Sbirrazzuoli N, Macromolecules, 29(6), 1867 (1996)

[8] Cho CS, Fu SC, Chen LW, Wu TR, Polym. Int., 47, 203 (1998)

[9] Guo QP, Polymer, 36(25), 4753 (1995)

[10] Li YS, Li MS, Chang FC, J. Polym. Sci. A: Polym. Chem., 37, 8614 (1999)

[11] Tanaka Y, Kakiuchi H, J. Appl. Polym. Sci., 7, 1063 (1963)

[12] Mijovi J, Kim J, Slaby J, ibid., 29, 1449 (1984)

[13] Lee JY, Shim MJ, Kim SW, Korean J. Mater. Res., 5, 667 (1995)