Sn-3.5Ag/Cu의 계면반응 및 접합특성

정명준; 이경구; 이도재; Myoung Joon Jung; Kyung Ku Lee; Doh Jae Lee

Korean Journal of Materials Research, Vol.9, No.7, 747-752, July, 1999

Export Citation

Sn-3.5Ag/Cu의 계면반응 및 접합특성

The Interfacial Reaction and Joint Properties of Sn-3.5Ag/Cu

정명준, 이경구¹, 이도재

전남대학교 공과대학 금속공학과
¹한려대학교 제철금속학과

Myoung Joon Jung, Kyung Ku Lee¹, and Doh Jae Lee

Dept. of Metallurgical Engineering, Chonnam National University, Kwangju, 500-757, Korea
¹Dept. of Iron Metallurgical Engineering, Kanlyo Univ., Kwangynag 545-800, Korea

초록

Sn-3.5Ag, Sn-3.5Ag-lZn Eoa납과 Cu기판과의 계면반응 및 접합특성에 관하여 검토하였다. Eoa납과 Cu기판이 접합된 시편은 100 ? C 와 160 ? C 에서 60일간 열처리하였으며, 전단하중을 가하여 강도를 측정하였다. 150 ? C 에서 열처리에 따른 계면반응층의 두게는 Sn-3.5Ag/Cu계면이 Sn-3.5A9-IZn/Cu계면보다 빠르게 성장하였으며, 반응생성물 성장은 t 1/2 에 비례하여 체적 확산 경향을 나타냈다. 계면 반응생성물은 Sn-3.5Ag/Cu계면의 경우 Cu 6 Sn 5 상이 형성되었고, Ag 3 Sn 상은 반응층 내부 및 반응층과 땜납의 계면에 석출하였으며, Zn을 첨가한 경우에는 계면에 Cu 6 Sn 5 상과 함께 Cu 5 Zn 8 상이 형성되었다. 땜납/기판의 전단강도는 Sn-3.5Ag합금에 Zn을 1% 첨가하면 증가하였으며, 열처리를 한 경우에는 감소하였다.

The interfacial reaction and joint properties of Sn-3.5Ag/Cu and Sn-3.5Ag-1Zn/Cu joint were studied. Modified double lap shear solder joints of Sn-3.5Ag and Sn-3.5Ag- lZn solder were aged for 60days at 100 ? C and 150 ? C and then loaded to failure in shear. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-lZn at the aging temperature of 150 ? C Through the SEM/EDS analysis of solder joint, it was proved that intermatallic layer was Cu 6 Sn 5 phase and aged specimens showed that intermatallic layer grew in proportion to t 1/2 , and the precipitate of Ag 3 Sn occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, Cu 6 Sn 5 phase formed at the side of substrate and Cu 5 Zn 8 phase formed at the other side in double layer. The shear strength of the Sn-3.5Ag/Cu joint improved by addition of IZn. The strength of the joint increases with strain rate and decreases with aging temperature.

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[1] Zisman WA, Ind. Eng. Chem., 10, 19 (1963)

[2] Betrabet HS, Mckinlay JK, Mcgee SM, J. Mater Sci., 27, 4009 (1992)

[3] Loomans ME, Vaynman S, Ghosh G, Fine ME, J. Electron. Mater., 23, 741 (1994)

[4] Harada M, Satoh R, IEEE Trans. Comp., 13, 736 (1990)

[5] Flanders DR, Jacobs EG, Pinizzotto RF, JEM, 26, 883 (1977)

[6] Mccormack M, Jin S, JEM, 23, 715 (1994)

[7] Grivas D, Frear D, Quan LK, Morris JW, J. Electr. Mat., 15, 355 (1986)

[8] Budavari S, The Merck Index(Eleventh Edition), 1597 (1989)

[9] Loomans ME, Vaynman S, Ghosh G, Fine ME, J. Electron. Mater., 23, 745 (1994)

[10] Glazer J, Metallurgy of Low Temperature Pb-free Solders for Electronic Assembly, 40, 71 (1995)

[11] Mccormark M, JIN S, J. Met., 45, 35 (1993)

[12] Vianco PT, Hlava PF, Kilgo AC, JEM, 23, 583 (1994)

[13] Fear D, Grivas D, Morris JW, JEM, 16, 181 (1987)

[14] A Study on Wettability, Interfacial Reaction and Mechanical Properties of between Sn-Zn system Solders and Cu substrate, Shim JB, M. S. Thesis/ v.40, 1996 (1996)

[15] Ghosh G, Paper presented at TMS fall meeting/ 1995 (1995)

[16] Mei Z, Sunwoo AJ, Morris JW, Metall Trans., 23A, 857 (1992)