Microstructure and corrosion behavior of electrodeposited nanocrystalline nickel prepared from acetate bath

Ramachandran Sekar; Kopula Kesavan Jagadesh; Giri Nagasamy Kuppusamy Ramesh Bapu

Korean Journal of Chemical Engineering, Vol.32, No.6, 1194-1200, June, 2015

DOI10.1007/s11814-014-0289-7 Export Citation

Microstructure and corrosion behavior of electrodeposited nanocrystalline nickel prepared from acetate bath

Ramachandran Sekar^†, Kopula Kesavan Jagadesh, and Giri Nagasamy Kuppusamy Ramesh Bapu

Electroplating and Metal Finishing Technology Division, Central Electro Chemical Research Institute, Karaikudi 630 006, Tamil Nadu, India

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The present investigation deals with the electrodeposition of nanocrystalline nickel onto mild steel metallic foil from electrolytes containing nickel acetate as the major metal salt. Two different chlorides, potassium chloride and nickel chloride, were tried for two different baths. Potassium citrate was used as buffer for alternate to boric acid. The additives tried were sodium lauryl sulfate as wetting agent, saccharin as primary brightener and 2-butyne 1,4-diol as secondary brightener. These additives are found to improve the hardness, grain size, surface morphology of the electrodeposited nickel films and throwing power of the nickel acetate electrolytes. The nickel films prepared from nickel chloride containing electrolytes showed higher corrosion resistance as compared to potassium chloride containing electrolytes, because the nickel films produced from the nickel chloride electrolytes are compact and possess fine grained structure. The XRD pattern obtained for electrodeposited nickel shows polycrystalline face centered cubic structure. The crystal size was calculated using Scherrer formula. A uniform and pore free surface was observed under SEM analysis.

Keywords:Additive;Electrodeposition;SEM Analysis;Crystal Size;XRD;Corrosion

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Trasatti S, Electrochim. Acta, 37, 2137 (1992)
Franklin TC, Plat. Surf. Finish., 81, 62 (1994)
Oniciu L, Muresan L, J. Appl. Electrochem., 21, 565 (1991)
Plieth W, Electrochim. Acta, 37, 2115 (1992)
Sekar R, Eagammai C, Jayakrishnan S, J. Appl. Electrochem., 40(1), 49 (2010)
Merchant HD, Defect structure, morphology and properties of deposits, Warrendale, PA, TMS Publication 1 (1995). (1995)
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Doi T, Mizumoto K, Tanaka S, Yamashita T, Met. Finish, 102, 26 (2004)
Sekar R, Jayakrishnan S, Plat. Surf. Finish., 92, 58 (2005)
Sekar R, Kala C, Krishnan RM, Trans. Inst. Met. Finish, 80, 173 (2002)
Sekar R, Krishnan RM, Muralidharan VS, Trans. Inst. Met. Finish, 82, 164 (2004)
Silman H, Isserlis G, Averill AF, Protective and decorative coatings for metals, Teddington England, Finishing Publications Ltd. (1978).
Sekar R, Jayakrishnan S, J. Appl. Electrochem., 36(5), 591 (2006)
Conway BE, JO’M Bockris, Plating, 46, 371 (1959)
ASTM-G102-89 Standard Practice for calculation of Corrosion Rates and related information from Electrochemical Measurements, 03.02 435 (2001).
Stern M, Geary AL, J. Electrochem. Soc., 104, 56 (1957)
Cullity BD, Elements of X-ray diffraction, USA, Addison Wesley(1967). (1967)
Klug HP, Alexander L, X-ray diffraction procedures for polycrystalline and amorphous materials, New York, Wiley (1980).
Gyawali G, Hamal K, Joshi B, Rajbhandari A, Lee SW, Mater. Lett., 126, 228 (2014)
Mansfield F, Kendig W, Tasi S, Corrosion, 38, 570 (1982)
Survilline S, Cesuniene A, Juskena R, Trans. Inst. Met. Finish, 82, 185 (2004)
Survilline S, Jasualaitiene V, Cesuniene A, Trans. Inst. Met. Finish, 83, 130 (2005)
Holm M, O’ Keefe TJ, J. Appl. Chem., 83, 1125 (2000)
Gai LP, Mitra R, Weertman JR, Pure. Appl. Chem., 74, 1519 (2002)
Amblard J, Epelboin I, Froment M, Maurin G, J. Appl. Electrochem., 9, 223 (1979)
Mc Cormack AG, Pomeroy MJ, Cunnane VJ, J. Electrochem. Soc., 150, 356 (2003)
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[1] Lowenheim FA, Modern electroplating, New York, McGraw-Hill(1978).

[2] Ebrahimi F, Kong D, Matthews TE, Zhai Q, Processing and Fabrication of Advanced Materials VII Ed., Warrendale, PA, TMS Publication, 509 (1988).

[3] Trasatti S, Electrochim. Acta, 37, 2137 (1992)

[4] Franklin TC, Plat. Surf. Finish., 81, 62 (1994)

[5] Oniciu L, Muresan L, J. Appl. Electrochem., 21, 565 (1991)

[6] Plieth W, Electrochim. Acta, 37, 2115 (1992)

[7] Sekar R, Eagammai C, Jayakrishnan S, J. Appl. Electrochem., 40(1), 49 (2010)

[8] Merchant HD, Defect structure, morphology and properties of deposits, Warrendale, PA, TMS Publication 1 (1995). (1995)

[9] Dennis JK, Such TE, Nickel and Chromium plating, London, Newnes-Butterworths, 163 (1972). (1972)

[10] Notification of the Director General of the Environment Agency in Japan, 2, 22 (1999). (1999)

[11] Doi T, Mizumoto K, Tanaka S, Yamashita T, Met. Finish, 102, 26 (2004)

[12] Sekar R, Jayakrishnan S, Plat. Surf. Finish., 92, 58 (2005)

[13] Sekar R, Kala C, Krishnan RM, Trans. Inst. Met. Finish, 80, 173 (2002)

[14] Sekar R, Krishnan RM, Muralidharan VS, Trans. Inst. Met. Finish, 82, 164 (2004)

[15] Silman H, Isserlis G, Averill AF, Protective and decorative coatings for metals, Teddington England, Finishing Publications Ltd. (1978).

[16] Sekar R, Jayakrishnan S, J. Appl. Electrochem., 36(5), 591 (2006)

[17] Conway BE, JO’M Bockris, Plating, 46, 371 (1959)

[18] ASTM-G102-89 Standard Practice for calculation of Corrosion Rates and related information from Electrochemical Measurements, 03.02 435 (2001).

[19] Stern M, Geary AL, J. Electrochem. Soc., 104, 56 (1957)

[20] Cullity BD, Elements of X-ray diffraction, USA, Addison Wesley(1967). (1967)

[21] Klug HP, Alexander L, X-ray diffraction procedures for polycrystalline and amorphous materials, New York, Wiley (1980).

[22] Gyawali G, Hamal K, Joshi B, Rajbhandari A, Lee SW, Mater. Lett., 126, 228 (2014)

[23] Mansfield F, Kendig W, Tasi S, Corrosion, 38, 570 (1982)

[24] Survilline S, Cesuniene A, Juskena R, Trans. Inst. Met. Finish, 82, 185 (2004)

[25] Survilline S, Jasualaitiene V, Cesuniene A, Trans. Inst. Met. Finish, 83, 130 (2005)

[26] Holm M, O’ Keefe TJ, J. Appl. Chem., 83, 1125 (2000)

[27] Gai LP, Mitra R, Weertman JR, Pure. Appl. Chem., 74, 1519 (2002)

[28] Amblard J, Epelboin I, Froment M, Maurin G, J. Appl. Electrochem., 9, 223 (1979)

[29] Mc Cormack AG, Pomeroy MJ, Cunnane VJ, J. Electrochem. Soc., 150, 356 (2003)

[30] Ibanez A, Fatas E, Surf. Coat. Technol., 191, 7 (2005)

[31] Budevski E, Staikov G, Lorenz WJ, Electrochim. Acta, 45, 2259 (2000)