화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Journal of Industrial and Engineering Chemistry, Vol.22, 120-126, February, 2015
DOI10.1016/j.jiec.2014.06.032  Export Citation
Ink-jetting and rheological behavior of a silica particle suspension
Wen Ling Zhang, Hyoung Jin Choi†, Hyun-Seok Ko1, and Kye-Si Kwon2
  • Department of Polymer Science and Engineering, Inha University, Incheon 402-751, South Korea
  • 1Department of Electrical & Robot Engineering, Soonchunhyang University, Asan, 336-745, South Korea
  • 2Department of Mechanical Engineering, Soonchunhyang University, Asan, 336-745, South Korea
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To understand the particle-suspended inkjet behavior better, silica particle solutions with different particle sizes were dispersed in ethylene glycol. The effects of the particle size on the jetting behavior was examined using a laboratory-developed drop watcher system in addition to their rheological properties determined using a rotational rheometer. The drying characteristics of the silica solutions with different particle sizes on a glass substrate were also investigated. The results revealed a similar size of deposition droplets after the evaporation of droplets at 5 wt%, whereas a smaller deposition size was observed at 1 wt%.
Keywords:Silica particle;Suspension;Rheology;Ink-jetting
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