화학공학소재연구정보센터
Applied Catalysis B: Environmental, Vol.170, 241-254, 2015
Cu-substituted ZSM-5 catalyst: Controlling of DeNO(x) reactivity via ion-exchange mode with copper-ammonia solution
The regularities of sorption and stabilization of Cu2(+) ions in Cu-ZSM-5 catalysts prepared via the ion-exchange have been studied. The copper sorption by H-, Na-, and NH4-ZSM-5 from aqueous and ammonia solutions of copper salt had a good approximation as the Langmuir mould of a monolayer adsorption. At ideal ion-exchange condition, only the isolated copper ions located in the zeolite ionexchange position are formed. Observation of other Cu structures with extra-lattice oxygen is a result of the hydrolysis of hexaaquacopper(II) complex and its polycondensation reactions. They exist as (1) dimer and copper-oxide structures with chain-like and square-planar coordination of extra-lattice oxygen Jigands, which which are located inside zeolite channels, and (2) oxide clusters and CuO nanoparticles dispersed on the zeolite crystallite surface. The RedOx properties and DeNO(x) reactivity in selective catalytic reduction of nitrogen oxide by propane of copper-substituted ZSM-5 have been compared. The dynamics of DeNO(x) reactivity correlates with the growth in the number of the isolated Cu2+ ions and the Cu structures with extra-lattice oxygen, which are formed during the ion exchange of H-ZSM-5 with water ammonia solutions of copper acetate with NH4OH/Cu2+ close to 6 (pH similar to 10.5). On the other hand, reactivity decreases with an increase in the content of copper-oxide clusters on the external surface of zeolite, which are observed in the ion-exchanged Cu ZSM-5 at NH4OH/Cu2+ below 6. Besides, the Cu2+ ions stabilized during the ion-exchange mode with strong-alkaline ammonia copper solution (NH4OH/Cu2+ =30) are less reducible in H-2-TPR experiment compared with catalysts produced from ammonia-free and weak-ammonia solution of copper acetate, probably due to the low copper loading, stabilization of isolated Cu-oh(2+) ions with large distance between each other, decoration of copper ions by a thin silica/alumina layer or formation of Cu-silicates. (C) 2015 Elsevier BM. All rights reserved.