Pd surface activation via a sonochemical approach was studied by varying Pd precursor status in the aqueous solution. By aging a K2PdC16 activation solution overnight with added NH4OH, the chlorinated Pd complex was changed to an ammonia-based Pd complex. The Pd surface activation carried out with the NH4OH complexing agent resulted in improved surface condition following Cu electroless deposition. The Cu thin film deposited on a substrate sonochemically activated with the aged, ammonia-based Pd complex showed improved surface roughness and resistivity compared to that for Cu films deposited via two other precursors (chlorinated Pd complex and ammonia-based complex) without aging. In addition, nitrogen purging during sonochemical activation improved Cu film quality. (C) 2015 Elsevier B.V. All rights reserved.