화학공학소재연구정보센터
Applied Surface Science, Vol.353, 540-547, 2015
Study of metal specific interaction, F-LUMO and VL shift to understand interface of CuPc thin films and noble metal surfaces
The performances of organic electronic devices are significantly associated with their energy level alignment at organic semiconductor/metal-electrode interfaces. The electronic character of an organic semiconducting molecular over-layer on a metal surface can vary from semiconducting to metallic, depending on the nature of the molecular orbitals with respect to the Fermi level of the electrode. The general tendency of extrapolating established models for single crystal substrates to 'real' device substrates is highly misleading. Hence, the importance of metal specific interaction, former lowest unoccupied molecular orbital (F-LUMO) and vacuum level (VL) shift have been investigated as a function of thickness of the deposited films by means of photoelectron spectroscopy (XPS and UPS) to understand the interface between CuPc and Cu, Ag, Pt and Au foils sequentially. The XPS data provides the signature of affectability of pyrrole sites of CuPc molecules for partial charge transfer from Cu and Ag substrates while a negligible effect on pyrrole cites resulted for Pt and Au substrates. Furthermore, the appearance of F-LUMO, a hybridized state close to the Fermi level gives confirmatory information about partial charge transfer. Contrary to the general belief that vacuum level shift caused by charge transfer can partially or totally cancel that for push back effect, our observation indicates that the partial charge transfer does not play significant role in the shift of vacuum level. The entire thickness dependent electronic energy level alignment of CuPc films on all noble metal substrates is explained in terms of a combined effect of partial charge transfer and photoemission final state relaxation energy. A systematic variation of HOMO-FWHM was observed with CuPc thickness due to continuous change in molecular orientation. (C) 2015 Published by Elsevier B.V.